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HDI circuit board blind hole wiring method

A wiring method and circuit board technology, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuits, etc., can solve the problems of blind vias that cannot be routed, blind vias cannot perform pattern transfer, etc., and achieve signal transmission. Stability, good anti-noise performance, and the effect of improving wiring density

Inactive Publication Date: 2017-01-04
TIGERBUILDER CIRCUIT SUZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the manufacturing process of HDI circuit boards, there are many defects and difficulties in the process, the most important of which are problems such as blind hole depressions that cannot be routed, and patterns that cannot be transferred to form lines on blind holes.

Method used

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  • HDI circuit board blind hole wiring method
  • HDI circuit board blind hole wiring method

Examples

Experimental program
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Effect test

Embodiment 1

[0025] Embodiment 1, a blind hole wiring method of an HDI circuit board, the HDI circuit board in this embodiment is a single

[0026] Laminates. Its specific wiring method includes the following steps.

[0027] S01: Design circuit wiring diagram. In the specific implementation, first design the circuit wiring diagram passing through the blind hole, design the production plan according to the requirements of the layout circuit wiring diagram, and select the materials used for evaluation and pre-compensate the conductor thickness, width and insulating layer thickness during etching . Since the circuit wiring diagram is set according to product requirements, there is no limitation in this embodiment.

[0028] S02: Making a substrate of an HDI circuit board, and the substrate is provided with a plurality of blind holes. During specific implementation, the position of the blind hole is set according to the requirements of the circuit line. The design requirements of blind hol...

Embodiment 2

[0037] Embodiment 2. The difference between this embodiment and Embodiment 1 is that the HDI circuit board in this embodiment is a multi-layer circuit board. Therefore, the blind hole wiring method of the HDI circuit board in this embodiment further includes the following steps.

[0038] The following steps are also included after step S05 of Embodiment 1.

[0039] S06: Laminating the multi-layer substrates, and adding an insulating medium layer between the substrates. During specific implementation, the thickness and uniformity of the insulating medium layer are controlled, that is, the thickness and distribution of the insulating medium layer in step S06 are uniform.

[0040] S07: Coating an insulating layer of conductor lines on the outermost substrate.

[0041] Wherein, the step S07 is after the step S06. The thickness and distribution of the insulating layer in the step S07 are uniform.

[0042] During the implementation of the above embodiments, it is mainly investiga...

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Abstract

The present invention provides an HDI circuit board blind hole wiring method. The method comprises the following steps: S01: designing a circuit wiring diagram; S02: making the substrate of an HDI circuit board, wherein the substrate is provided with a plurality of blind holes; S03: employing the electroplating process to fill and level up the blind holes; S04: employing the circuit diagram image transferring method to arrange the circuit wiring diagram on the substrate; and S05: employing the etching method to etch a conductor circuit on the substrate according to the circuit wiring diagram.

Description

technical field [0001] The invention relates to the fields of electronics and circuits, in particular to a blind hole wiring method of an HDI circuit board. Background technique [0002] With the vigorous development of today's electronics industry, the global PCB industry has developed rapidly. my country, as a large PCB production country, accounts for more than 40% of the world's output, and has developed rapidly. In particular, the emergence of High Density Interconnect Technology (HDI) has promoted the continuous innovation of various electronic devices, especially the rapid replacement of smart electronic devices in recent years, which has greatly affected the multi-functional and high-end printed circuit board products. Integration, thinner, lighter, smaller and other aspects put forward more and higher technical innovation requirements, pushing the circuit board products to become thinner and thinner, with more and more layers, finer and thinner wiring, It is becomi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/06H05K2201/09509H05K2203/05
Inventor 陈斌
Owner TIGERBUILDER CIRCUIT SUZHOU
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