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Gold bonding wire and production method thereof

A technology for bonding wires and intermediate alloys, which is used in the manufacture of semiconductor/solid-state devices, circuits, and electric solid-state devices, etc., can solve the problems of low radian, the electrical properties and mechanical properties of bonding wires cannot meet the market demand, etc., and can reduce the radian. , the effect of increasing strength and shortening length

Active Publication Date: 2017-01-04
广东佳博电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In recent years, with the diversification of the market and the advancement and innovation of technology, especially the increasingly stringent requirements for product quality in the application field, the bonding gold wire produced in the past has gradually failed to meet market demand and technological progress in terms of electrical and mechanical properties. ; In addition, with the further miniaturization and integration of semiconductor components, the diameter refinement and strength improvement of bonding gold wire have become new requirements; in addition, short heat-affected zone and low arc are also the inevitable direction of technological development

Method used

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  • Gold bonding wire and production method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] The composition of the bonding gold wire is (mass percentage): 99.9974% gold, 0.0010% silver, 0.0001% iron, 0.0005% lead, 0.0001% magnesium, 0.00010% copper, and 0.0080% rare earth elements. The preparation process steps are: 1) One-time refining, the block gold raw material is put into a high-frequency electromagnetic induction furnace for one-time refining, argon protective gas is used in the refining process, the refining temperature is 1200°C, and the refining time is 80 minutes to obtain primary refined gold Melt; 2) Secondary refining, the primary refined gold melt and intermediate alloy are added to the continuous casting furnace at the same time, and secondary refining is carried out at an ultra-high temperature of 1180 ° C. During the refining process, argon protective gas is used, and the refining time is 90 minutes , make full use of the eddy current of the furnace itself, cooperate with the special mechanical automatic stirring device to stir the melt, stir 1...

Embodiment 2

[0020] A bonded gold wire, the composition of the bonded gold wire is (mass percentage): 99.9930% gold, 0.0020% silver, 0.0010% iron, 0.0015% lead, 0.0010% magnesium, 0.00020% copper, 0.0010% silicon, and 0.0003% rare earth elements.

[0021] The preparation method refers to Example 1.

Embodiment 3

[0023] A bonded gold wire, the composition of the bonded gold wire is (mass percentage): more than 99.9935% gold, 0.0015% silver, 0.00050% iron, 0.0010% lead, 0.0005% magnesium, 0.0020% copper, 0.0005% silicon, and 0.0005% rare earth elements .

[0024] The preparation method refers to Example 1.

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Abstract

The invention discloses a gold bonding wire and a production method thereof. The gold bonding wire comprises, by weight percentage, more than 99.99% of gold, 0.0010-0.0020% of silver, 0.0001-0.0010% of iron, 0.0005-0.0015% of lead, 0.0001-0.0010% of magnesium, 0.00010-0.0020% of copper, 0-0.0010% of silicon and 0.0003-0.0008% of rare-earth elements. The production method mainly includes: primary refining, secondary refining, continuous casting, drawing, cleaning, annealing, winding and packaging. The gold bonding wire has the advantages that the rare-earth elements are added on the basis of component optimization, process parameters are optimized, and accordingly the strength of the super-thin gold bonding wire is increased, the ductility and rupturing load of the gold bonding wire are increased, the length of a heat-affecting area is reduced greatly, radian is lowered effectively, the service life of the gold bonding wire is prolonged, and the application range of the gold bonding wire is expanded.

Description

technical field [0001] The invention relates to the technical field of bonding gold wire processing, in particular to a bonding gold wire and a preparation method thereof. Background technique [0002] Bonding wire is an important accessory in semiconductors. It is often used as an inner lead for microelectronic packaging. It is an important basic material for integrated circuits and semiconductor components. In the actual production process, bonding gold wires are mainly divided into JC2, JC3, JE1 and JE2. Types, they have different chemical compositions, electrical properties, and mechanical properties. In recent years, with the diversification of the market and the advancement and innovation of technology, especially the increasingly stringent requirements for product quality in the application field, the bonding gold wire produced in the past has gradually failed to meet market demand and technological progress in terms of electrical and mechanical properties. ; In ad...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/49H01L21/48C22C1/03C22C1/06C22C5/02
CPCC22C1/03C22C1/06C22C5/02H01L21/4889H01L23/49H01L24/45H01L2224/45144H01L2224/45H01L2924/00012
Inventor 赵碎孟周钢
Owner 广东佳博电子科技有限公司
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