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Sanding tank for production of composite electroplated diamond wires and utilization method of sanding tank

A diamond wire and composite electroplating technology, applied in the direction of electrolytic coatings, coatings, etc., can solve the problems of poor wire diameter uniformity of finished wires, insufficient structure design of the upper sand tank, and poor distribution of diamond micro-powders, etc. The effect of controllable sand application rate, improved efficiency and coating uniformity

Active Publication Date: 2017-01-04
张家口原轼新型材料股份有限公司
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Problems solved by technology

The main problems of the electroplated diamond wire produced by the existing technology are poor distribution of diamond powder on the steel wire busbar, local agglomeration, and poor uniformity of the finished wire diameter, resulting in shortened diamond wire life and scratches on the cutting surface of the workpiece. , and the main reason lies in the lack of structural design of the upper sand tank in the electroplating process

Method used

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  • Sanding tank for production of composite electroplated diamond wires and utilization method of sanding tank
  • Sanding tank for production of composite electroplated diamond wires and utilization method of sanding tank

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Embodiment Construction

[0027] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0028] figure 1 Among them, an upper sand tank for producing a composite electroplating diamond wire, including an upper sand tank body, an inlet liquid circulation device, an inlet liquid distribution device, a steel wire transmission device, and the like.

[0029] The upper sand tank body 1 includes three areas, the middle area is the upper sand area, the two side areas are overflow areas, and the middle partition of the three areas is equipped with a liquid level adjustment plate 2; the lower part of the overflow area of ​​the upper sand tank body There is a return pipe 4;

[0030] figure 2 Among them, the cross section of the lower part of the upper sand area is a lower narrow trapezoid; one side of the upper sand area of ​​the upper sand tank body is equipped with a titanium basket 3, and nickel balls are housed in the titanium basket. Anode; the len...

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Abstract

The invention provides a sanding tank for production of composite electroplated diamond wires and a utilization method of the sanding tank. The sanding tank mainly comprises a sanding tank body, a liquid inlet circulation device, a liquid inlet distribution device and a steel wire conveying device. The liquid inlet distribution device with multi-stage distribution pipes is adopted for feeding liquid through the bottom of a sanding area, liquid inlet flow fields of a longitudinal area of the whole sanding area are basically uniform in distribution, flow rate controllability is realized, and diamond particles close to a steel wire busbar immersed in the whole sanding area are uniform in longitudinal distribution; after electrification for electroplating, sanding speed of the diamond particles on the steel wire busbar is controllable, and the particles are less prone to clustering and well distributed. The sanding tank can be used for continuous production of the electroplated diamond wires which are great in diamond particle distribution, uniform in wire diameter and excellent in cutting performance, and structural reasonability, high production efficiency and high raw material utilization rate are realized.

Description

technical field [0001] The invention relates to the technical field of composite electroplating, in particular to a sand tank device for producing composite electroplating diamond wires and a method for using the same. Background technique [0002] With the designation and implementation of the country's new energy strategic plan, the development and utilization of solar energy has become more and more important. In recent years, the demand for large-area silicon wafers for solar photovoltaic power generation has also continued to increase. Due to the maturity of semiconductor manufacturing technology, the manufacturing cost of other aspects of silicon wafers continues to decline, but limited by the development of cutting technology, the cutting cost of silicon wafers for photovoltaics has always been high, still accounting for about 30% of the total manufacturing cost. At present, the main method of cutting silicon wafers in my country is still the free abrasive cutting tec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D15/00
CPCC25D15/00
Inventor 叶琴胡欣占晓强
Owner 张家口原轼新型材料股份有限公司
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