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Substrate fixing fixture for magnetron sputtering coating machine and using method

A magnetron sputtering and fixture fixing technology, applied in sputtering coating, ion implantation coating, vacuum evaporation coating and other directions, can solve the problems of uneven force on the contact surface of the substrate, easy deformation, surface pollution and other problems , to reduce the accidental deviation of the results, improve the uniformity and improve the efficiency

Active Publication Date: 2018-07-06
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most of the commonly used fixtures are made of T7 steel, medium carbon steel or high carbon steel. Although the fixtures made of these materials can meet the requirements of general working conditions, they are prone to deformation under special working conditions such as high temperature conditions. , surface contamination and other issues
In addition, the currently commonly used fixtures are often straight and one side of the tablet is in direct contact with the substrate, which will cause uneven force on the contact surface of the substrate, especially when the substrate is tilted or inverted, it is more difficult to fix, which is extremely difficult. easy to drop

Method used

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  • Substrate fixing fixture for magnetron sputtering coating machine and using method
  • Substrate fixing fixture for magnetron sputtering coating machine and using method
  • Substrate fixing fixture for magnetron sputtering coating machine and using method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] Such as image 3 and Figure 4As shown, the annular positioning groove 5 is preferably one, and its depth is 0.2 mm, and its width is 10.2 mm; the thickness of the selected substrate is 0.5 mm, and its diameter is 10 mm; the aperture of the sputtering through hole 401 in the center of the pressing sheet 4 is 9 mm; The thickness of the gasket 2 is 0.3 mm. The operation process is as follows:

[0049] Step 1. Take a pressing piece 4 and a screw 3, pass the screw 3 through the hard alloy pressing piece 4 and the washer 2 in turn, and connect it to the bottom plate 1, in a slightly loose state;

[0050] Step 2. Gently place the substrate in the groove on the bottom plate 1, and gently push the substrate from the side to the position corresponding to the bottom plate screw hole 101 described in step 1;

[0051] Step 3. Rotate the pressing piece 4, install the screw 3 on the other end of the pressing piece 4, press the pressing piece 4 lightly to ensure that the pressing p...

Embodiment 2

[0054] The thickness of the selected substrate is 0.2m, and the gasket 2 is not needed at this time. The operation process is as follows:

[0055] Step 1. Take a pressing piece 4, use a screw 3 to pass through the pressing screw hole 402 on one side of the pressing piece 4, and then screw it into the bottom plate screw hole 101;

[0056] Step 2, place the substrate in the annular positioning groove 5 on the bottom plate 1, and push the substrate from the side to the position corresponding to the bottom plate screw hole 101 described in step 1;

[0057] Step 3. Rotate the pressing piece 4, install the other end of the pressing piece 4 on the bottom plate 1 through the screw 3, and tighten the connected screw 3, so that the pressing piece 4 is in close contact with the substrate, and the contact surface is circular;

[0058] Step 4. Repeat steps 1 to 3 to install each substrate in turn.

Embodiment 3

[0060] When the thickness of the substrate is the same as the depth of the annular positioning groove 5, the pressing plate 4 with a baffle plate 6 can be used. The baffle plate 6 is arranged in the middle of the long side of the pressing plate 4, and there are two pieces whose width is smaller than the sputtering through hole. The diameter and height of 401 are equal to the depth of the annular positioning groove 5 , which can completely prevent the substrate from loosening and moving in the annular positioning groove 5 .

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Abstract

A substrate fixing clamp for a magnetron sputtering machine comprises a bottom plate and a plurality of pressing pieces for fixing a substrate to the bottom plate. The bottom plate is circular, and one or more annular positioning grooves for containing the substrate and concentric with the bottom plate are dug in the upper surface of the bottom plate. The pressing pieces are evenly arranged on the annular positioning grooves along the annular positioning grooves and are rectangular. The axes in the length direction of the pressing pieces coincide with the radial direction of the annular positioning grooves. Sputtering through holes are formed in the middles of the pressing pieces and located over the annular positioning grooves, and the aperture of the sputtering through holes is smaller than the width of the annular positioning grooves. The parts, close to the two ends, of each pressing piece are each provided with a pressing piece screw hole. Bottom plate screw holes corresponding to the pressing piece screw holes one to one are formed in the bottom plate. The pressing pieces are connected with the bottom plate through a plurality of screws penetrating through the pressing piece screw holes and the bottom plate screw holes. The substrate fixing clamp can be suitable for plating work of different substrates, can keep the machining state of substrates stable, and is easy to maintain.

Description

technical field [0001] The invention relates to the field of magnetron sputtering devices, in particular to a substrate fixing fixture for a magnetron sputtering coating machine and a use method thereof. Background technique [0002] As the magnetron sputtering coating method is more and more widely used in production, it is more and more important to improve production efficiency and simplify the production process. The ability to mount multiple substrates simultaneously on a baseplate is an effective way to increase efficiency and reduce occasional deviations in results. In addition, simplifying the installation process of the substrate and improving the firmness of the substrate are also aspects to improve the success rate of coating. Reasonable use of fixtures can simplify the coating process, reduce costs, shorten the time of the entire process, and improve overall efficiency. [0003] Now the commonly used magnetron sputtering coating machine can heat the bottom plat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/35
CPCC23C14/35C23C14/50
Inventor 王爱琴梁婷婷刘帅洋田捍卫杨康赵海丽谢敬佩王文焱李继文
Owner HENAN UNIV OF SCI & TECH
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