High-frequency and high-speed electronic circuit board based on high thickness-radius ratio deep hole electroplating technology

Abstract

The invention discloses a high-frequency and high-speed electronic circuit board based on a high thickness-radius ratio deep hole electroplating technology. The high-frequency and high-speed electronic circuit board comprises a master control board and a signal transmission module, wherein the master control board comprises a receiving chip and a driving chip and adopts a double-sided flexible circuit board, a polyester resin material is further arranged on an outer surface of the master control board, a printed circuit board with high reliability and relatively high flexibility is fabricated by taking the polyester resin material as a substrate, four holes are drilled in an upper right end of the master control board, an output end of the master control board is connected with a voltage regulation module and a rectification module, the voltage regulation module is connected with a pulse generation module through a receiving end signal detection module, a signal transmission module is connected with a signal detection module, and the signal detection module is connected with a DC-DC converter. The circuit board has high heat dissipation, light weight, miniaturization and thinness are achieved by reducing a size, so that a component device and a wire are integratedly connected.

Description

technical field [0001] The invention relates to the technical field of electronic circuit boards, in particular to a high-frequency and high-speed electronic circuit board based on high-thickness ratio deep-hole electroplating technology. Background technique [0002] With the development of electronic product production technology, people began to develop interlayers on the basis of double-sided circuit boards. In fact, it is to superimpose a single-sided board on the basis of double-sided boards. This is a multi-layer circuit board. At first, the interlayer was mostly used for large-area ground wires and power wire wiring, and the surface layer was used for signal wiring. Later, more and more interlayers were required for signal wiring, which required an increase in the number of layers of the circuit board. However, interlayers cannot be increased indefinitely, mainly due to cost and thickness issues. General manufacturers hope to obtain as high performance as possible a...

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Problems solved by technology

However, interlayers cannot be increased indefinitely, mainly due to cost and thickness issues. General manufacturers hope to obtain as high performance as possible at the lowest possible cost, which is different from the prototype machine design done in the laboratory. Therefore, electronic product design Those who want to consider the contradictory complex of cost performance, and the most practical design method is still to use the surface layer as the signal wiring layer as the first choice, and the components of the high-frequency circuit cannot be arranged too densely, otherwise the radiation of the components themselves will directly affect the Interference with other components

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