Inner layer windowing multilayer flexible circuit board cover removing method

Abstract

The present invention discloses an inner layer windowing multilayer flexible circuit board cover removing method. The method comprises the following steps of S1 carrying out the electro-coppering processing on an inner layer windowing multilayer flexible circuit board, and arranging a circle of copper-free groove at the periphery of a protection cover exactly facing an inner layer windowing; S2 utilizing a laser cutting line to cut the protection cover along the copper-free groove; S3 jittering to enable the protection cover to fall off. According to the present invention, the cutting depth can be controlled better at the laser cutting, the depth controllability of the laser cutting is guaranteed greatly, and the risk that the laser cutting damages an inner-layer FPC is reduced, at the same time, the stress of the protection cover after the protection cover is cut by the laser cutting is guaranteed, the protection cover falls off naturally at jitter, the quality problems, such as the rim charge residual of the protection cover, a torn outer-layer circuit, etc., do not occur.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for opening a cover of a multi-layer soft board with an inner layer opening a window. Background technique [0002] FPC is also called flexible circuit board (flexible PCB), referred to as "soft board", also known as "flexible circuit board", also known as "flexible circuit board, flexible circuit board" or "flexible circuit board, flexible circuit board" , English is "FPC" or "FPCB". [0003] For products with windowed pads in the inner layer of multi-layer FPC, the protective cover at the windowed area is the outer layer FCCL (flexible board base material), and the outer layer FCCL is used to protect it to prevent the potion from affecting the pads at the inner windowed area. The erosion of the outer layer of the circuit is done after the protective cover is removed. There are two general methods for removing the protective cover. [0004] The first one is to ...

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Problems solved by technology

[0004] The first one is to manually peel off the protective cover after cutting the edge material area of ​​the protective cover by laser. Its advantage is that there is no risk of damage to the inner circuit. For the outer circuit in the multi-layer area outside the cover, a large number of burrs on the protective cover, abnormal tearing of the circuit, and low efficiency are caused by improper human operation.

[0005] The second method is to manually remove the protective cover after all the protective cover is cut by laser. This method can effectively overcome the shortcomings of the first method, but when using this method, the laser depth is caused by the uneven thickness of the protective cover and the combination of multiple layers. Uncontrollable, there is a risk of damaging the inner circuit

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