Array substrate and manufacturing method thereof

Abstract

The invention provides an array substrate and manufacturing method thereof The array substrate comprises a display area and a driving area, wherein the driving area comprises a pad area having a plurality of pads electrically connected with an external flexible circuit board. The array substrate is characterized in that the pad area comprises a glass substrate, a first insulating layer, a second insulating layer and a third insulating layer, which are arranged from bottom to top sequentially, wherein all pads are arranged on the surface of the third insulating layer, and the second insulating layer and the third insulating layer are each provided with a through hole on the area between two adjacent pads. Section display is increased greatly, attaching area of ACF glue in a limited space is increased, and the adhesion capability of ACF is improved. FOG and FPC contact impedance is reduced, the compression scope of conductive ion in ACF glue becomes large, the compression ratio is increased, and the FOG and FPC contact impedance is reduced.

Description

technical field [0001] The invention relates to the field of liquid crystal display, in particular to an array substrate and a manufacturing method thereof. Background technique [0002] Since LTPS has the advantage of high mobility, the W / L of the TFT switch can be designed to be very small when designing the pixel, so that the aperture ratio corresponding to the pixel is relatively high, which has a great market competitive advantage. Traditional LTPS pixel cross section see figure 1 ,From figure 1 It can be seen that, on the glass substrate 10, a light-shielding layer (LSM) 11, a first insulating layer 12, a polysilicon layer 13, a second insulating layer 14, a gate layer 15, a third insulating layer 16, and a source 17 are sequentially arranged. , a drain electrode 18 , an organic flat layer 19 , a common electrode layer 20 , a passivation layer 21 and a pixel electrode layer 22 . It can be seen that there are many layers of LTPS, and 11 layers are commonly used at pr...

AI Technical Summary

Problems solved by technology

When the resolution corresponding to the panel increases, the number of FOG Pads will increase. In the same space, when the number of FOG Pads increases, the size (length, width) of the FOG Pads will decrease. For each FOG Pad In other words, the coating area of ​​ACF glue will be reduced, which will directly lead to an increase in the contact resistance between FOG Pad and FPC, affecting the display

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