Working table of silicon ingot cutting machine, silicon ingot cutting machine and silicon ingot cutting method

Abstract

The invention discloses a workbench for a silicon ingot cutting machine, the silicon ingot cutting machine and a silicon ingot cutting method. The workbench comprises at least two station platforms and a station conversion device, wherein the station platforms are arranged in parallel and used for supporting silicon ingots; each station platform comprises a platform base and silicon ingot supporting platforms arranged on the platform base; and the station conversion device is connected to the station platforms and used for driving the station platforms to move so that the station positions of the station platforms can be converted. According to the workbench for the silicon ingot cutting machine, the station positions of the station platforms are converted through the station conversion device, thus, automatic and accurate conversion of the station platforms can be achieved, alternate cutting can be achieved on the to-be-cut silicon ingots loaded on the station platforms through a linear cutting device, the effect that the multi-batch silicon ingots can be orderly subjected to cutting operation is ensured, and the problems that the cutting efficiency is low, and a workbench is inconvenient to convert in the prior art are solved.

Description

technical field [0001] The invention relates to a multi-wire cutting technology, in particular to a working table of a silicon ingot cutting machine, a silicon ingot cutting machine and a silicon ingot cutting method. Background technique [0002] Wire cutting technology is a relatively advanced square extraction processing technology in the world at present. Its principle is to rub the workpiece (such as silicon ingot, sapphire, or other semiconductor hard and brittle materials) through high-speed moving diamond wire to cut out a square ingot. , so as to achieve the purpose of cutting. During the cutting process of the workpiece, the diamond wire is guided by the guide wheel to form a wire net on the main wire roller, and the workpiece to be processed is fed by the rise and fall of the worktable or the rise and fall of the diamond wire. Under the action of the pump, the cooling water automatic spraying device installed on the equipment sprays the cooling water to the cutti...

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Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a workbench of a silicon ingot cutting machine, a silicon ingot cutting machine and a method for cutting a silicon ingot, which are used to solve the problem of low cutting efficiency and low workbench in the prior art. Problems such as inconvenient conversion

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