Infrared and/or ultraviolet sample wafer pressing die

Abstract

The invention relates to an infrared and / or ultraviolet sample wafer pressing die. The infrared and / or ultraviolet sample wafer pressing die comprises a base with a circular boss and a framework connected with the base in a thread matched mode. A cylindrical hollow cavity is formed in the center of the framework in the axial direction, an internal thread is arranged on the inner wall of the cylindrical hollow cavity and connected with a cylinder pressing head through threads, and the other end of the pressing head is connected with a die sleeve. The center of the circular boss of the base is fixedly connected a cylindrical column platform matched with the pressing head to extrude powder into shapes. The column platform is connected with the internal thread of the cylindrical hollow cavity, and the column platform is provided with a forming ring for powder forming. According to the infrared and / or ultraviolet sample wafer pressing die, due to the fact that all connection is achieved through the threads, die discharging and releasing can be conducted conveniently; due to the fact that the column platform is provided with the forming ring for powder forming, power extrusion forming is convenient, and the powder can be placed into a transmission detector to be subjected to infrared and / or ultraviolet transmission detection conveniently after being taken out.

Description

technical field [0001] The invention belongs to the technical field of battery production, and in particular relates to an infrared and / or ultraviolet tablet pressing die. Background technique [0002] The infrared tableting mold is used to press the test sample. The general mold includes a base and a mold cylinder arranged on the base. Placed between the lower end of the top mold and the lower tablet block. [0003] But at present, the cooperation between the top mold and the mold cavity is a tight fit, and the sample powder is easy to absorb water and adhere to the inner wall of the mold cavity, so that the top mold is in the process of film pressing and demoulding. The frictional resistance between them is large, which not only makes it difficult to press the film and release the mold, but also easily damages the formed sheet, which often leads to the failure of the tableting and repeated tableting operations. Contents of the invention [0004] The object of the prese...

AI Technical Summary

Problems solved by technology

[0003] But at present, the cooperation between the top mold and the mold cavity is a tight fit, and the sample powder is easy to absorb water and adhere to the inner wall of the mold cavity, so that the top mold is in the process of film pressing and demoulding. The friction resistance between them is large, not only it is difficult to press the film and release the mold, but also it is easy to damage the formed sheet, which often leads to the failure of the tablet and repeated tablet operations

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