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Thermally conductive fluororubber and preparation method thereof, and laser projection equipment

A fluororubber and thermally conductive filler technology, which is applied in the field of thermally conductive fluororubber and its preparation, can solve the problems of poor thermal conductivity and decreased mechanical properties of fluororubber, and achieve the effects of good processing performance, improved uniform dispersion and uniform distribution.

Active Publication Date: 2018-02-13
HISENSE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the inventors found that there is a problem that although the thermal conductivity of the thermally conductive rubber can be improved by adding modified graphene, it will also cause the mechanical properties of the fluororubber to decline rapidly
Moreover, sometimes there are cases where the heat conduction effect is poor

Method used

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  • Thermally conductive fluororubber and preparation method thereof, and laser projection equipment
  • Thermally conductive fluororubber and preparation method thereof, and laser projection equipment
  • Thermally conductive fluororubber and preparation method thereof, and laser projection equipment

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preparation example Construction

[0043] A preparation method of heat-conducting fluororubber, comprising the following steps:

[0044] Step 1. Disperse the thermally conductive filler into the fluororubber matrix;

[0045] Step 2, dispersing the vulcanizing agent into the fluororubber matrix;

[0046] Step 3, making the vulcanizing agent and the fluororubber matrix undergo a crosslinking reaction to obtain a heat-conducting fluororubber;

[0047] Wherein, the thermally conductive filler is a thermally conductive filler prepared according to the following method;

[0048] Step (a): react the fluororubber monomer, excess mercaptan and photoinitiator in the first organic solvent under the condition of light to obtain the first reactant, then remove the first organic solvent and unreacted mercaptan The compound obtains a second reactant, and the second reactant is dissolved in a second organic solvent to obtain a solution of the second reactant;

[0049] Step (b): dispersing the metal powder into the solution ...

Embodiment 1

[0075] Step 1, 100 parts of fluororubber raw rubber (that is, fluororubber matrix) is plasticized for 10 minutes on an open mill with a roll distance of 5 mm, then add 10 parts of thermally conductive filler (the preparation method of thermally conductive filler is as described later ) was mixed for 15 minutes;

[0076] Step 2, adding 2 parts of bisphenol AF and 0.5 part of benzyltriphenylphosphorous chloride to the raw material after mixing;

[0077] Step 3. Thin pass pressing 6 times on an open mill with a roller distance of 1 mm, and then enlarge the roller distance to 1.5 mm to remove the sheet and park to obtain a heat-conducting fluororubber.

[0078] Preparation of thermally conductive filler

[0079] The preparation method of the thermally conductive filler in the present embodiment is as follows:

[0080] Step (a), add 100 parts of vinylidene fluoride, 2 parts of 3,6-dioxa-1,8-octanedithiol, and 2 parts of BAPO into tetrahydrofuran in sequence, stir at room temper...

Embodiment 2

[0083] Step 1, 100 parts of fluororubber raw rubber (that is, fluororubber matrix) is plasticized for 10 minutes on an open mill with a roll distance of 2 mm, and then 40 parts of thermally conductive fillers are added (the preparation method of thermally conductive fillers is as described later. ) was mixed for 20 minutes;

[0084] Step 2, adding 2.3 parts of bisphenol AF and 0.7 part of benzyltriphenylphosphorous chloride to the raw material after mixing;

[0085] Step 3. Thin pass and press 8 times on an open mill with a roller distance of 0.5 mm, and then enlarge the roller distance to 2 mm to remove the sheet and park to obtain a heat-conducting fluororubber.

[0086] Preparation of thermally conductive filler

[0087] The preparation method of the thermally conductive filler in the present embodiment is as follows:

[0088] Step (a), add 100 parts of vinylidene fluoride, 20 parts of 3,6-dioxa-1,8-octanedithiol, and 20 parts of BAPO into tetrahydrofuran in turn, stir ...

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Abstract

The invention provides a heat-conducting fluororubber and a preparation method thereof, and a laser projection apparatus including the heat-conducting fluororubber. The preparation method for the heat-conducting fluororubber comprises the following steps: step 1, dispersing a heat-conducting filling material into a fluororubber matrix; step 2, dispersing a vulcanizing agent into the fluororubber matrix; and step 3, subjecting the vulcanizing agent and the fluororubber matrix to a crosslinking reaction so as to obtain the heat-conducting fluororubber; wherein the heat-conducting filling material is prepared by compounding fluororubber monomer with metal powder by using a solution mixing method. According to the preparation method for the heat-conducting fluororubber, the heat-conducting filling material is prepared by compounding the metal powder with the fluororubber monomer in advance; and through intermiscibility between the fluororubber monomer compounded with the metal powder and the fluororubber matrix, uniform dispersibility of the heat-conducting filling material in the fluororubber matrix is improved.

Description

technical field [0001] The invention relates to a heat-conducting fluororubber, a preparation method thereof, and a laser projection device containing the heat-conducting fluororubber. Background technique [0002] Fluorine rubber refers to a synthetic polymer material containing fluorine atoms on the carbon atoms of the main chain or side chain. Therefore, fluorine rubber has good heat resistance and cold resistance, and has excellent weather resistance, ozone resistance and good insulation. Therefore, fluorine rubber can be widely used in medical, daily life, industry and other fields. In particular, fluorine rubber is also frequently used in the field of electronic assembly. However, in recent years, electronic assembly is developing in the direction of densification, which leads to the continuous increase of the power density of electronic components, and it is easy to cause excessive temperature during use. Therefore, in the application of fluororubber, high thermal co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L27/12C08L27/16C08K3/08C08K5/136C08K5/50C08F114/22C09K5/14G03B21/16
CPCC08F114/22C08L27/12C08L2205/02C09K5/14G03B21/16C08L27/16C08K2003/0856C08K5/136C08K5/50C08K2003/0831C08K2003/085
Inventor 戴洁邢哲
Owner HISENSE
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