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Thermally conductive silicone rubber, preparation method thereof, and laser projection equipment

A technology of thermally conductive silicone rubber and silicone rubber matrix, applied in optics, instruments, projection devices, etc., can solve problems such as uneven dispersion, achieve uniform distribution, good processing performance, and improve uniform dispersion.

Active Publication Date: 2019-03-01
HISENSE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The inventor found that although the method in the above patent document CN102827480A can improve the contact performance between the thermally conductive filler and the silicone rubber matrix, there is still the phenomenon of uneven dispersion

Method used

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  • Thermally conductive silicone rubber, preparation method thereof, and laser projection equipment
  • Thermally conductive silicone rubber, preparation method thereof, and laser projection equipment
  • Thermally conductive silicone rubber, preparation method thereof, and laser projection equipment

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preparation example Construction

[0051] A preparation method of heat-conducting silicone rubber, comprising the following steps:

[0052] Step 1, dispersing the thermally conductive filler into the silicone rubber matrix;

[0053] Step 2, dispersing the vulcanizing agent into the silicone rubber matrix;

[0054] Step 3, making the vulcanizing agent and the silicone rubber matrix undergo a crosslinking reaction to obtain thermally conductive silicone rubber;

[0055]Wherein, the thermally conductive filler is a thermally conductive filler prepared according to the following method;

[0056] Step (a): react the silane chloride containing at least one double bond, excess thiol and photoinitiator in the first organic solvent under the condition of light to obtain the first reactant, then remove the first organic solvent and The unreacted thiol compound obtains a second reactant, and the second reactant is dissolved in a second organic solvent to obtain a solution of the second reactant;

[0057] Step (b): disp...

Embodiment 1

[0087] Step 1. Mix 80 parts of raw silicone rubber (i.e., silicone rubber matrix), 20 parts of silicone oil, and 10 parts of thermally conductive filler (the preparation method of thermally conductive filler is described later) at 60°C for 30 minutes in the first stage; Afterwards, the temperature was raised to 75°C for the second stage of mixing for 30 minutes;

[0088] Step 2, adding 0.3 parts of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane to the mixed raw materials;

[0089] Step 3, heat-press molding at 150° C. and a pressure of 10 MPa for 80 minutes to obtain heat-conducting silicone rubber.

[0090] Preparation of thermally conductive filler

[0091] The preparation method of the thermally conductive filler in the present embodiment is as follows:

[0092] Step (a) Add 78 parts of dichlorosilane, 1 part of 3,6-dioxa-1,8-octanedithiol, and 1 part of BAPO to the tetrahydrofuran solution in sequence, stir at room temperature, and wait until the reactants are completely...

Embodiment 2

[0095] Step 1. Mix 100 parts of raw silicone rubber (that is, silicone rubber matrix) and 40 parts of thermally conductive filler (the preparation method of thermally conductive filler is described later) at 70°C for 5 minutes; then heat up to 85°C °C for the second stage of mixing for 5 minutes;

[0096] Step 2, adding 5 parts of 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane to the mixed raw materials;

[0097] Step 3, heat-press molding at 170° C. and a pressure of 100 MPa for 80 minutes to obtain thermally conductive silicone rubber.

[0098] Preparation of thermally conductive filler

[0099] The preparation method of the thermally conductive filler in the present embodiment is as follows:

[0100] Step (a) Add 100 parts of dichlorosilane, 10 parts of 3,6-dioxa-1,8-octanedithiol, and 10 parts of BAPO into the tetrahydrofuran solution in turn, stir at room temperature, and wait until the reactants are completely After dissolving, keep stirring and react for 24 hours und...

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Abstract

The invention provides a heat conductive silicone rubber, a preparation method of the heat conductive silicone rubber, and laser projection equipment comprising the heat conductive silicone rubber. The preparation method of the heat conductive silicone rubber comprises the following steps: 1, dispersing a heat conductive filler into a silicone rubber substrate, 2, dispersing a vulcanizing agent into the silicone rubber substrate, and 3, conducting cross linking reaction on the vulcanizing agent and the silicone rubber substrate to obtain the heat conductive silicone rubber, wherein the a heat conductive filler is formed by compounding silane polymers and metal powder through a solution mixing method. According to the preparation method of the heat conductive silicone rubber, the used heat conductive filler is obtained by compounding the metal powder and the silane polymers in advance, and the silane polymers compounded with the metal powder have excellent solubility with the silicone rubber substrate, so that the uniform dispersity of the heat conductive filler in the silicone rubber substrate can be improved.

Description

technical field [0001] The invention relates to a heat-conducting silicone rubber, a preparation method thereof, and a laser projection device containing the heat-conducting silicone rubber. Background technique [0002] The main chain of silicone rubber is composed of silicon and oxygen atoms, and the side chains are carbon-containing groups. Due to the close combination of silicon-oxygen bonds, silicone rubber has good heat resistance and cold resistance, and has excellent weather resistance, ozone resistance and good insulation. Therefore, silicone rubber can be widely used in medical treatment, life, industry, etc. in the field. In particular, silicone rubber is also frequently used in the field of electronic assembly. However, in recent years, electronic assembly is developing in the direction of densification, which leads to the continuous increase of the power density of electronic components, and it is easy to cause excessive temperature during use. Therefore, for ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/04C08K3/08C08K5/14G03B21/16
CPCC08K3/08C08K5/14C08K2201/003C08K2201/011C08L83/04C08L2205/025C08L2205/03G03B21/16C08K2003/0856C08K2003/0831C08K2003/085
Inventor 戴洁邢哲
Owner HISENSE
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