Adjustable type reflow soldering machine

Abstract

The invention discloses an adjustable type reflow soldering machine, and belongs to the technical field of reflow soldering machines. The adjustable type reflow soldering machine comprises a conveying rail, an air cooling device arranged below the conveying rail and a water cooling mechanism connected with the air cooling device, wherein the air cooling device comprises a wind box, a plurality of fans, an air inlet and an air outlet; the multiple fans are arranged at the air outlet; a flow adjustment device is arranged at the air inlet; the water cooling mechanism comprises a water storage tank, a plurality of cooling pipes, a backflow pipe and a backflow pump; the water storage tank is arranged at one side of the reflow soldering machine, and is provided with a water inlet and a water outlet; a heat dissipation device is arranged at the water inlet; the multiple cooling pipes are arranged in the wind box; one end of each cooling pipe is connected with the water outlet, and the other end of each cooling pipe is connected with the backflow pipe; the backflow pipe is connected with the cooling pipes and the water inlet; the heat dissipation device comprises a heat dissipation groove, a rotating shaft arranged at a notch of the heat dissipation groove and a plurality of heat dissipation fins arranged on the rotating shaft; and heat dissipation strips are arranged at two side surfaces of each heat dissipation sheet. The adjustable type reflow soldering machine can adapt to the environment temperature and guarantee a proper cooling speed after a PCB is soldered so as to guarantee the soldering quality.

Description

technical field [0001] The invention relates to the technical field of reflow soldering machines, in particular to an adjustable reflow soldering machine. Background technique [0002] The reflow soldering machine is a commonly used soldering equipment in the surface mount industry. Its processing mainly includes: 1. Place one or more PCB circuit boards in the heating box of the reflow soldering machine; 2. Pass through evenly distributed heating tubes Evenly heat the PCB circuit board in a high temperature environment, and after a certain period of time, complete the one-time soldering of the solder joints on the surface of the PCB circuit board; 3. Turn on the cooling fan on the heating box to quickly cool the PCB circuit board, take out the PCB circuit board, The welding process is complete. Among them, the cooling speed after high-temperature soldering has a great influence on the quality of the solder joints. If the cooling is too slow, the brightness of the solder joi...

AI Technical Summary

Problems solved by technology

Among them, the cooling speed after high-temperature soldering has a great influence on the quality of the solder joints. If the cooling is too slow, the brightness of the solder joints will not be high, and it will be easy to break and peel off; Solder joint crack

[0003] Existing reflow soldering machines generally only use a few heat dissipation fans to cool the PCB board, which can maintain the stability of the blowing efficiency, but the cooling speed of the PCB board is also affected by the ambient temperature, and the temperature in the workshop is too high or too low Under the circumstances, its cooling rate is often greatly affected, thus affecting the quality of component welding

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