Low-loss high-isolation flip-chip small-node array radio-frequency switch and mobile terminal thereof

Abstract

The invention discloses a low-loss high-isolation flip-chip small-node array radio-frequency switch and a mobile terminal thereof. The low-loss high-isolation flip-chip small-node array radio-frequency switch is characterized in that a flip-chip process is adopted in the radio-frequency switch; radio-frequency input and output ports of tandem passages of each radio-frequency switch are connected by adopting small nodes or multiple relatively small high-density nodes; and parallel passages of each radio-frequency switch are grounded by adopting relatively small high-density nodes. According to the low-loss high-isolation flip-chip small-node array radio-frequency switch and the mobile terminal thereof disclosed by the invention, the radio-frequency signal input and output ports can be connected by using relatively small flip-chip nodes, so that coupling of the nodes and the radio-frequency passage can be reduced; grounding is carried out by using multiple relatively small high-density flip-chip nodes, so that inductance of the nodes and the insertion loss of the radio-frequency switch can be reduced; and thus, the isolating characteristic and the maximum output power of the radio-frequency switch can be increased.

Description

technical field [0001] The invention relates to a radio frequency switch, in particular to a radio frequency switch which adopts high-density small-node flip-chip technology, has low loss, high isolation and balanced heat dissipation, and a mobile terminal thereof. Background technique [0002] The radio frequency transmitting front-end module is a key component for radio frequency terminal devices to realize signal transmission. Currently, with the rapid growth of global wireless communication users and users' higher-end experience requirements for wireless communication, the market demand for wireless communication bandwidth is growing rapidly. In order to solve this market demand, more and more dedicated wireless communication frequency bands have been opened up around the world and are becoming more and more crowded. The main modulation and demodulation methods with high utilization rate of mobile phone wireless communication frequency band, such as: 3G wideband code di...

AI Technical Summary

Problems solved by technology

However, the disadvantage of this design scheme is that due to the uniform size of the flip-chip node (generally a larger node), the flip-chip node in the layout of the actual design of the RF switch is too large, which causes the series or parallel connection with the RF switch. The coupling effect of the interconnection path, which is more common in complex flip-chip RF switches, results in a significant reduction in the maximum workable power and linearity of the RF switch

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