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A device having a carrier substrate and at least one electrical component disposed thereon, and the electrical component

A technology for carrier substrates and electrical components, which is applied in the field of electrical components and can solve problems such as no contact, incorrect contact area, slippage, etc.

Active Publication Date: 2016-11-02
VTESCO TECH GMBH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when such a conveyor belt is started with a carrier substrate on which the electrical components are placed, a problem arises that especially relatively large and heavy components (not yet mechanically connected to the carrier substrate) are subjected to jolts, thereby Causes the solder ball to slip on the contact area of ​​the carrier substrate, and when the solder ball melts, it can cause poor or no contact at all, or the solder ball can even connect to the incorrect contact area

Method used

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  • A device having a carrier substrate and at least one electrical component disposed thereon, and the electrical component

Examples

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Embodiment Construction

[0016] exist figure 1 In the example of , the electrical component 1 is an integrated semiconductor circuit, the semiconductor chip of which is arranged in a housing 2, the housing 2 is provided with contact balls 3, the contact balls 3 are formed as a ball grid array, and are used according to the present invention By way of invention, the housing 2 has fixed solder balls 4 in the peripheral region. In order to secure the electrical component 1 on the carrier substrate 5 against rotation, at least two fixed solder balls 4 are necessary, but more fixed solder balls 4 are also possible. If there is no risk of rotation, a fixed solder ball is enough.

[0017] The carrier substrate 5 has a recess 6 in which figure 1 In the exemplary embodiment shown in , the recesses 6 are formed as through-holes in the carrier substrate 5 , one of these through-holes having a metallization 8 on the wall. The diameters of the fixing balls 4 and the recesses 6 are chosen such that the fixing ba...

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Abstract

The present invention discloses a device having a carrier substrate and at least one electrical component disposed thereon and the electrical component. The device has a carrier substrate (5) with a contact region (7) and at least one electrical component (1) arranged thereon, the electrical component (1) having on its surface oriented towards the carrier substrate (5) a plurality of contact welding balls (3) which are respectively connected to contact areas (7) assigned to them, wherein a surface of the electrical component (1) oriented towards the carrier substrate (5) is provided with at least one fixed welding ball (4), of which the diameter is larger than that of the contact solder ball (3). The carrier substrate (5) has a recess (6) at least one position where the fixed welding ball (4) contacts the carrier substrate (5), and the fixed welding ball (4) is placed in the recess.

Description

technical field [0001] The invention relates to a device having a carrier substrate with contact regions and at least one electrical component arranged thereon, the surface of the electrical component oriented towards the carrier substrate having a plurality of contact balls which are each connected to a distribution to their contact area. [0002] The invention also relates to an electrical component having a plurality of solder balls arranged on one of its surfaces. Background technique [0003] Such a device and such an electrical component are known from DE 10 2004 044 603 A1. The electrical components therein are formed as surface mount semiconductor components, and the solder balls of the component are arranged in a ball grid array (ball grid array, BGA). In principle, however, all surface-mounted electrical and electronic components are to be understood as being within the scope of the present invention. During mounting, these components are usually placed on the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31
CPCH01L23/3128H01L2224/16H01L2924/15311H01L23/49838H01L23/49827H01L24/17H01L2224/16227H01L2224/16237H01L2224/16055H01L2224/16057H01L2224/1703H01L2224/16235
Inventor M.格岑贝格尔
Owner VTESCO TECH GMBH
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