A processing fixture and processing method for realizing aluminum-nickel bonding of ceramic chip packaging devices

Abstract

The present invention provides a processing fixture for realizing aluminum-nickel bonding of a ceramic patch packaged device and a processing method therefor. The processing fixture includes a base board. A large area of groove is disposed in the middle of an upper end of the base board. A gas nozzle is mounted on one side surface of the base board. The gas nozzle is connected into the groove in the base board. A rubber pad is mounted on the upper end of the base board. Multiple cavities are disposed on an upper end of a location board. Every two adjacent cavities are separated by a clapboard. The cavity is internally provided with three air holes penetrating the location board in a vertical direction. Through adoption of the processing fixture and the processing method, debonding caused by bonding strength of gold and aluminum is prevented, and due to use of pure nickel sheets, nickel-plated copper sheets are simple to assemble, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of semiconductor element processing, in particular to the field of processing ceramic chip packaging devices. Background technique [0002] For a long time, in the manufacturing process of semiconductor power devices, aluminum wires are directly bonded to gold-plated parts, and aluminum wires are directly bonded to the surface of gold-plated dies. In theory, there will be Kirkendall voids in the bond between gold and aluminum. Kendall voids will affect the bonding strength, may lead to debonding, and seriously affect the quality of the device. Moreover, during the assembly process of nickel-plated copper sheets, it is necessary to install positioning sleeves in the cavity on the tube base one by one. After installing the positioning sleeves, it is necessary to quantitatively spot solder paste on the two welding areas of each tube base, and then place the nickel-plated copper For the copper sheet, due to the small siz...

AI Technical Summary

Problems solved by technology

[0002] For a long time, in the manufacturing process of semiconductor power devices, aluminum wires are directly bonded to gold-plated parts, and aluminum wires are directly bonded to the surface of gold-plated dies. In theory, there will be Kirkendall voids in the bonding between gold and aluminum. Kendall voids will affect the bonding strength and may lead to debonding, seriously affecting the quality of the device

Moreover, during the assembly process of nickel-plated copper sheets, it is necessary to install positioning sleeves in the cavity on the tube base one by one. After installing the positioning sleeves, it is necessary to quantitatively spot solder paste on the two welding areas of each tube base, and then place the nickel-plated Copper sheet, due to the small size of the transitional nickel-plated copper sheet (1.8mmX1.8m square sheet), it is difficult to place it in alignment, and the above steps are all manual operations, so the workload is large and the efficiency is low

And using manual spot solder paste, can not achieve quantitative uniformity, which has a certain impact on the sintering quality

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