Processing fixture for realizing aluminum-nickel bonding of ceramic patch packaged device and processing method therefor
A chip packaging and processing method technology, applied in the direction of electrical solid devices, semiconductor devices, semiconductor/solid device manufacturing, etc., can solve problems such as inability to achieve quantitative uniformity, affect bonding strength, and affect device quality. Faster clamping and alignment time, easy mass production, and the effect of ensuring the appearance quality
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[0029] The technical solution of the present invention is further described below, but the scope of protection is not limited to the description.
[0030] A processing fixture for realizing aluminum-nickel bonding of ceramic chip packaged devices; including a base plate 4, the base plate 4 is provided with a large-area groove in the middle of the upper end, and an air nozzle 3 is installed on one side of the base plate 4, and the air nozzle 3 is connected to the In the groove on the bottom plate 4, a rubber pad 2 is installed on the upper end of the bottom plate 4, and a plurality of cavities 5 are arranged on the upper end of the positioning plate 1, and each cavity 5 is separated by a partition 7, and the cavities There are three air holes 6 through which the positioning plate 1 is penetrated in the vertical direction.
[0031] The shape, size and area of the end faces of the positioning plate 1, the rubber pad 2 and the bottom plate 4 are all the same.
[0032] The rubbe...
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