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Refrigerating mechanism used for cooling of interior of vehicle headlamp assembly

A technology for automobile headlights and headlights, which is applied to vehicle parts, cooling/heating devices of lighting devices, road vehicles, etc. needs, the effect of a reasonable structure

Inactive Publication Date: 2016-10-12
ANHUI LANRUI ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a refrigeration mechanism for cooling the interior of the vehicle headlight assembly, so as to solve the problem that a large amount of heat cannot be effectively dissipated when LED products are used as automobile headlights

Method used

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  • Refrigerating mechanism used for cooling of interior of vehicle headlamp assembly

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Embodiment Construction

[0011] see figure 1 , a refrigeration mechanism used for cooling the interior of the vehicle headlight assembly, including a semiconductor refrigeration sheet 1 installed on the casing of the automobile headlight assembly or the inspection hole cover, the cold surface of the semiconductor refrigeration sheet 1 faces the car The inside of the headlight assembly is also connected with cooling fins 2, and the hot surface of the semiconductor cooling sheet 1 faces the outside of the automobile headlight assembly and is connected with cooling fins 3, and the cooling fins 2 and cooling fins 3 are respectively connected with Cooling fins 4 and cooling fins 5.

[0012] In the present invention, the semiconductor cooling chip 1 is fixed on the shell of the automobile headlight assembly or the cover plate of the inspection hole through the connecting mechanism 6 .

[0013] A circulating fan 7 and a cooling fan 8 are installed on the outer sides of the cooling fins 4 and the cooling fin...

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Abstract

The invention discloses a refrigerating mechanism used for cooling of the interior of a vehicle headlamp assembly. The refrigerating mechanism comprises a semiconductor refrigerating piece installed on a shell or an overhaul hole cover plate of the vehicle headlamp assembly; the cold face of the semiconductor refrigerating piece faces the interior of the vehicle headlamp assembly and is connected with a cold dissipating piece; the hot face of the semiconductor refrigerating piece faces the exterior of the vehicle headlamp assembly and is connected with a cooling piece; and the cold dissipating piece and the cooling piece are connected with cold dissipating fins and cooling fins correspondingly. The refrigerating mechanism used for cooling of the interior of the vehicle headlamp assembly is reasonable in structure and convenient to install and use; a semiconductor refrigerating mechanism is additionally arranged on the headlamp assembly shell, the temperature difference is formed between the interior and the exterior of the vehicle headlamp assembly, the cooling requirement of an LED headlamp is effectively guaranteed, and the normal work and service life of the LED headlamp are guaranteed.

Description

technical field [0001] The invention relates to the field of LED headlamps for vehicles, in particular to a refrigeration mechanism for cooling the interior of a vehicle headlamp assembly. Background technique [0002] The application of LED in automobiles is in full swing, but it has been difficult to make breakthroughs in the field of headlights. The main obstacle is heat dissipation. The working environment of automobile headlights is relatively harsh, and the average air temperature is above 70 degrees, which will lead to a very bad heat dissipation environment for LED chips. products, making it more difficult to dissipate heat. Heat dissipation performance is an important guarantee for the normal operation and service life of LED lights. If there is no good heat dissipation guarantee, the high heat generated by the light-emitting components during operation cannot be absorbed by the heat dissipation structure in a timely and efficient manner and transmitted to the outs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/10F21V23/04F21V29/54F21V29/67F21V29/76F21W101/02F21W101/10F21Y115/10F21W107/10
CPCF21S45/43F21S45/47F21V23/0442F21V29/54F21V29/67F21V29/76F21W2102/00F21W2107/10
Inventor 胡广储昭学王军
Owner ANHUI LANRUI ELECTRONICS TECH
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