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Pouring sealant for power electronic device

A technology for power electronic devices and potting glue, applied in the directions of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of increasing the viscosity of electronic potting materials, affecting the fluidity, mechanical properties and electrical properties, etc. Achieve the effect of reducing interface contact thermal resistance, effective heat conduction and insulation, and reducing production steps

Inactive Publication Date: 2016-09-28
苏州市奎克力电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in order to obtain electronic potting materials with better thermal conductivity, a large amount of filling and modification of silicone rubber is required, so that the viscosity of electronic potting materials is greatly increased, affecting its fluidity and mechanical and electrical properties after curing.

Method used

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  • Pouring sealant for power electronic device
  • Pouring sealant for power electronic device

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Embodiment Construction

[0022] The present invention will be further described in detail below with reference to the embodiments, so that those skilled in the art can implement it according to the text of the description.

[0023] A potting glue for power electronic devices, said potting glue comprising component A and component B, and the mass ratio of component A to component B is (6-10): (1.5-3), Wherein, the A component includes the following materials in parts by weight:

[0024] 20-30 parts of vinyl silicone oil;

[0025] 5~18 parts of methyl silicone oil;

[0026] 10-25 parts of hydrogen-containing silicone oil;

[0027] 3~15 parts of white carbon black;

[0028] The B component includes the following parts by weight:

[0029] 0.1~3 parts of platinum catalyst;

[0030] Plasticizer 5~14 parts;

[0031] Alkynol compound 1 to 5 parts.

[0032] In this embodiment, the vinyl silicone oil is a linear polydimethylsiloxane with vinyl groups at both ends, the mass percentage of the vinyl group is 0.1% to 0.42%, and ...

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PUM

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Abstract

This case discloses a potting compound for power electronic devices. The potting compound includes component A and component B, and the mass ratio of component A to component B is (6-10): (1.5- 3), wherein, the A component includes the following materials: vinyl silicone oil, methyl silicone oil, hydrogen-containing silicone oil, white carbon black; the B component includes the following materials: platinum catalyst, plasticizer, acetylenic alcohol compound. The object of the present invention is to provide a potting glue for power electronic devices, which can obtain uniform structure, high light transmittance, large refractive index, extensibility, A potting compound with good tensile strength and bonding strength, as well as excellent thermal conductivity and dielectric properties.

Description

Technical field [0001] The invention relates to an electronic potting glue, in particular to a potting glue for power electronic devices. Background technique [0002] With the development of power devices in the direction of high frequency, high power, and high current density, the requirements for miniaturization, reliable performance and life of the devices continue to increase. At the same time, it is required that potting parts must operate under high frequency, high temperature, high-speed rotation and other conditions. Therefore, the potting material is not only required to have excellent thermal conductivity and dielectric properties, but also to have excellent high and low temperature resistance, mechanical properties, flame retardancy and resistance to sulfur reduction. At present, the most commonly used potting materials are various synthetic polymers, such as epoxy resin, polyurethane resin and acrylic resin. Composite materials such as epoxy resin exhibit shortcomin...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J183/04C09J183/05C09J11/04
CPCC09J183/04C08L2205/025C08L2205/035C09J11/04
Inventor 蔡小连
Owner 苏州市奎克力电子科技有限公司
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