Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of preparation method of copper-silver composite powder and conductive adhesive

A technology of conductive adhesive and composite powder, which is applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of low utilization rate of copper and silver reagents, serious agglomeration between particles, and silver waste, and achieve excellent conductivity and Oxidation resistance, increased initial oxidation temperature, and stable service performance

Inactive Publication Date: 2018-01-19
CENT SOUTH UNIV
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese Patent Publication No. CN101294281A discloses "a preparation method of silver-plated copper powder for low-temperature slurry". The Ag content of this product is generally higher than 30%, but there is obvious oxidation at about 200 ° C, which affects the copper-silver bimetallic powder service stability
These methods for preparing copper-silver composite powder are mainly chemical methods, and they have common problems such as low utilization rate of copper-silver reagent, numerous procedures, and a large amount of waste liquid discharge.
In addition, the coating powders with embellished structure prepared by these traditional methods have low silver content on the surface and no room temperature oxidation resistance, resulting in ineffective waste of silver. At the same time, there are also problems such as low deposition rate, serious agglomeration between particles, and the interaction between silver coating and copper. Prominent problems such as weak binding force of powder

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of preparation method of copper-silver composite powder and conductive adhesive
  • A kind of preparation method of copper-silver composite powder and conductive adhesive
  • A kind of preparation method of copper-silver composite powder and conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] A preparation method of copper-silver composite powder of the present invention comprises the following steps:

[0032] (1) Put a graphite crucible with 400g of silver ingot and 3600g of copper plate into the Hermiga gas atomization device manufactured by British PSI company, heat it from room temperature to 1150°C at a rate of 50°C / min, and melt to obtain a uniform mixed alloy For the melt, use high-pressure nitrogen atomization to atomize the mixed alloy melt to obtain copper-silver alloy powder with a silver content of 10% (with a particle size of 120 microns or less).

[0033] (2) First sieve the copper-silver alloy powder obtained in step (1) to get -100 mesh powder, and then use 600 mesh and 800 mesh standard sieves to obtain copper-silver alloy powder with a particle size distribution range of 10 to 25 μm, such as figure 1 Shown is a nearly spherical powder.

[0034] (3) Weigh 20g of the copper-silver alloy powder sieved in step (2) and put it into a well-sealed...

Embodiment 2

[0037] A preparation method of copper-silver composite powder of the present invention comprises the following steps:

[0038] (1) Put a graphite crucible with 35g of silver ingot and 380g of copper plate into the Hermiga gas atomization device manufactured by British PSI company, heat it from room temperature to 1200°C at a rate of 50°C / min, and melt to obtain a uniform alloy melt The solution was atomized with high-pressure nitrogen gas to obtain copper-silver alloy powder with a silver content of 8.43% (with a particle size of 120 microns or less).

[0039](2) Sieve the copper-silver alloy powder obtained in step (1) to obtain -100-mesh powder, and then use 600-mesh and 800-mesh standard sieves to obtain copper-silver alloy powder with a particle size distribution range of 10-25 μm.

[0040] (3) Weigh 10g of the copper-silver alloy powder obtained in step (2) and put it into a well-sealed furnace, then use an electric oil pump to pump air until the vacuum in the furnace rea...

Embodiment 3

[0046] The preparation method of copper-silver composite powder of the present invention comprises the following steps:

[0047] (1) The seven silver ingots and copper plates are respectively 0.1g and 9.9g, 0.4g and 9.6g, 0.6g and 9.4g, 0.8g and 9.2g, 1.0g and 9.0g, 1.2g and 8.8g, The 1.4g and 8.6g graphite crucibles were put into the Hermiga gas atomization device manufactured by British PSI company, heated from room temperature to 1200°C at a rate of 50°C / min, and melted to obtain a homogeneous alloy melt, which was formed sequentially by high-pressure nitrogen atomization. Copper-silver alloy powders with silver mass content of 1%, 4%, 6%, 8%, 10%, 12% and 14% were obtained.

[0048] (2) Sieve the pure copper powder and the copper-silver alloy powder obtained in step (1) to obtain -100 mesh powder, and then use 600 mesh and 800 mesh standard sieves to obtain copper-silver alloy powder with a particle size distribution range of 10-25 μm .

[0049] (3) Weigh the 8 powders o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
shear strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a preparation method of highly conductive and anti-oxidation copper-silver composite powder, comprising the following steps: (1) preparing copper-silver alloy powder by gas atomization, wherein the mass percentage of silver in the copper-silver alloy powder is 3% to 3%. 14%; (2) aging the copper-silver alloy powder prepared in step (1) in a vacuum or an inert atmosphere to obtain copper-silver composite powder. In the present invention, the copper-silver alloy powder prepared by gas atomization is spherical, with a large particle size range (1-120 μm) and low silver content. After aging treatment, the silver-rich phase is preferentially precipitated at grain boundaries and other defects and forms a continuous The space network structure is conducive to the formation of silver conductive network, which enhances the conductivity to a certain extent. At the same time, since the defects (grain boundaries, pores, holes) in the matrix are covered by the precipitated silver phase, the preferential oxidation of copper-silver powder at defect positions such as grain boundaries at higher temperatures is effectively suppressed, which can significantly improve the resistance of the matrix. onset oxidation temperature.

Description

technical field [0001] The invention belongs to the technical field of powder metallurgy, and in particular relates to a preparation method of highly conductive and oxidation-resistant copper-silver composite powder and a conductive adhesive. Background technique [0002] As we all know, silver and copper are the two metals with the best electrical conductivity, and are indispensable materials for the electronics industry. Because silver has extremely high electrical and thermal conductivity and chemical stability (good oxidation resistance at high temperature), silver powder has been regarded as the material of choice for pastes used in the electronics industry for a long time as a conductive filler. However, silver has some unavoidable problems, such as easy migration of silver ions under the action of direct current and high cost. In particular, the short circuit problem caused by the migration of silver ions has become a major problem in the miniaturization and high int...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B22F1/00C22C9/00C09J9/02C09J11/04C09J163/00B22F1/065B22F1/142
CPCC08K3/08C09J9/02C09J11/04C09J163/00C22C9/00C08K2003/0806C08K2003/085B22F2999/00B22F1/065B22F1/142B22F1/00B22F2201/10B22F2201/20
Inventor 李云平李家翔
Owner CENT SOUTH UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com