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Tape coiling type intelligent card module SMD packaging structure and manufacturing method thereof

A chip packaging and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, electrical components, electric solid-state devices, etc., to achieve the effects of thin products, good heat dissipation, and high efficiency

Inactive Publication Date: 2016-08-10
SHANGHAI ETERNAL INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thickness, heat dissipation performance and packaging efficiency of the existing smart card chip chip packaging structure can no longer meet the needs of users. Therefore, there is an urgent need for a thinner packaging technology with better heat dissipation performance and higher packaging efficiency.

Method used

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  • Tape coiling type intelligent card module SMD packaging structure and manufacturing method thereof
  • Tape coiling type intelligent card module SMD packaging structure and manufacturing method thereof
  • Tape coiling type intelligent card module SMD packaging structure and manufacturing method thereof

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Embodiment Construction

[0027] The specific implementation of the tape and reel smart card module patch packaging structure and manufacturing method provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] see figure 1 The manufacturing method of the tape-and-reel smart card module patch packaging structure of the present invention includes the following steps: step S10, providing a carrier tape; step S11, making a plurality of package frames on the carrier tape, each package frame including a base island and the pins arranged around the base island; step S12, paste a chip on the base island; step S13, use metal soldering pieces to electrically connect the chip to the pins; step S14, package the The base island, pins and chips are described to form a plurality of packages on the carrier tape; step S15, winding the carrier tape with the packages or removing the carrier tape to form an independent package.

[0029] Figure 2A ~ Figure...

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PUM

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Abstract

The invention provides a tape coiling type intelligent card module SMD packaging structure and a manufacturing method. The tape coiling type intelligent card module SMD packaging structure comprises a base island, pins arranged around the base island, and a chip arranged on the surface of the base island. The chip is electrically connected with the pins via a metal pad. The base island, the pins and the chip are packaged by a plastic package body to form a packaging body. The tape coiling type intelligent card module SMD packaging structure can meet the machine-to-machine communication requirement in the field of internet of things. Compared with the conventional chip packaging structure, the above structure is thinner and better in heat dissipation effect. Meanwhile, compared with the conventional SMD packaging process, the efficiency is higher.

Description

technical field [0001] The invention relates to the field of smart card packaging, in particular to a tape-and-reel smart card module patch packaging structure and a manufacturing method. Background technique [0002] In the smart card industry, before producing finished contact smart cards and radio frequency smart cards, smart card chip suppliers generally provide smart card manufacturers and developers with chips packaged in strips as an important part of smart card components. [0003] The manufacturing process of the smart card chip supplier’s smart card chip packaging into strips is: after the smart card chip wafers are manufactured from the fab, they are cut into thin and slide operations into orderly arranged grains, and these smart card chips After the crystal grains are packaged on the strip, each grain is manipulated, and finally it is rolled into a reel like a film tape and provided to the smart card manufacturer. The smart card manufacturer's machines punch eac...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L23/488H01L23/49
CPCH01L23/488H01L23/49H01L24/10H01L24/42H01L24/81H01L24/85
Inventor 高洪涛陆美华刘玉宝
Owner SHANGHAI ETERNAL INFORMATION TECH
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