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Fabrication method of selective gold deposition plate

A production method and immersion gold plate technology, applied in the directions of printed circuit manufacturing, printed circuits, electrical components, etc., can solve problems such as the problem of gold on non-immersion gold areas that cannot be well solved, and reduce the defect rate and the risk of customer complaints. , Improve the effect of anti-sinking gold and save production costs

Active Publication Date: 2016-07-27
DONGGUAN MEADVILLE CIRCUITS
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  • Abstract
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AI Technical Summary

Problems solved by technology

Although using dry film to cover the non-immersion gold area can prevent gold on the non-immersion gold area to a certain extent, it still cannot solve the problem of gold on the non-immersion gold area. Even if 3 layers of dry film are used, the defect ratio is still low up to 10%

Method used

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Embodiment Construction

[0007] In order to make the technical solution of the present invention more clearly expressed, the present invention will be further described below.

[0008] The invention provides a method for making a selective immersion gold plate, which is used for carrying out immersion gold treatment on the immersion gold plate. The method includes the following steps:

[0009] (1) Provide immersion gold boards that require immersion gold, and each immersion gold board has an immersion gold area and a non-immersion gold area;

[0010] (2) Paste the dry film, paste the dry film on the non-immersion gold area of ​​the immersion gold board, the film pasting speed is 1.5m / min, the film pasting pressure is 0.5MPa, and the film pasting temperature is 120°C. The dry film includes PE and photoresist and PET. Among them, PE and PET only play the role of protection and isolation. Photoresist includes: linking agent, initiator, monomer, adhesion promoter, colorant. In order to further improve ...

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Abstract

A fabrication method of a selective gold deposition plate comprises the following steps of (1) providing gold deposition plates, wherein each gold deposition plate is provided with a gold deposition region and a non-gold deposition region; (2) pasting a dry film, wherein the dry film is pasted on the non-gold deposition region of the gold deposition plate; (3) exposing, wherein the dry film covering the non-gold deposition region is exposed; (4) printing an ink, wherein a layer of ink is printed on the dry film by a silk-screen printing mode; (5) depositing gold, wherein a gold plating layer is formed on the gold deposition region; (6) removing the ink; (7) removing the dry film; and (8) carrying out OSP processing. Before a gold deposition process, a layer of ink covers the dry film, the gold deposition resistant effect is improved, the gold proportion on a copper surface of the non-gold deposition region can be reduced to 2%, the reject ratio of the gold deposition plate and the customer complaint risk are greatly reduced, the gold dosage for production of a printed circuit board (PCB) is saved, the production cost is saved, and the economic benefit of an enterprise is improved.

Description

technical field [0001] The invention relates to a method for manufacturing a circuit board, in particular to a method for manufacturing a selective immersion gold board. Background technique [0002] With the rapid development of the PCB industry, the integration of circuit graphic design is getting higher and higher. For high-frequency signals, the requirements for signal transmission quality are getting higher and higher, and the structural design of PCB is becoming more and more strict. In order to ensure the quality of signal transmission, gold-plated process boards came into being. It has been widely used in surface treatment. [0003] In the existing immersion gold technology of PCB production, the immersion gold area and the non-immersion gold area are formed on the immersion gold board, and for the non-immersion gold area, DuPont W250 dry film is generally used to directly cover the non-immersion gold area, and then the immersion gold is carried out. Process treatm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/18
CPCH05K3/181H05K2203/0713H05K2203/072
Inventor 刘勇
Owner DONGGUAN MEADVILLE CIRCUITS
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