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High thermal conductive and insulating material and preparation method thereof

An insulating material and high thermal conductivity technology, applied in the field of high thermal conductivity insulating material and its preparation, can solve the problems of cumbersome synthesis method, inability of insulating thermal conductivity material to meet industrialization needs, and high requirements on two-phase compatibility, and achieves reasonable composition and curing. Good effect, good insulation effect

Inactive Publication Date: 2016-06-15
SUZHOU JIN TENG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the synthesis method is very cumbersome, and organic-inorganic hybrid materials have very high requirements for the compatibility of the two phases.
Therefore, it is necessary to develop new insulating materials to solve the problem that the current insulating and heat-conducting materials cannot meet the needs of industrialization

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] (1) In parts by mass, add 100 parts of bis((3,4-epoxycyclohexyl)methyl)adipate to 150 parts of ethylene glycol, stir at 110°C for 5 minutes, then add 6 parts of 3 -Tridecafluorohexylpropene, 10 parts of N-(3-hydroxyphenyl)acetamide, adjust the temperature to 120°C, stir for 35 minutes, then add 0.6 parts of glutaryl hydrazide and 1.1 parts of 4-tert-butylphenylacetylene, Stir for 2 hours; Add 6 parts of alumina again; Stir for 85 minutes to obtain epoxy material;

[0018] (2) In terms of parts by mass, mix 15 parts of graphene and 1 part of polyvinylpyrrolidone to obtain pretreated graphene; add 18 parts of N-acetyl p-aminophenol to 20 parts of ethanol, stir and mix for 40 minutes, and then Add 4 parts of silicon nitride, mix for 1 hour, then add the above-mentioned pretreated graphene, and stir at 50°C for 25 minutes to obtain a filler mixture;

[0019] (3) In parts by mass, add 1 part of the filler mixture prepared in step (2) to 5 parts of epoxy material prepared in...

Embodiment 2

[0022] (1) In parts by mass, add 100 parts of bis((3,4-epoxycyclohexyl)methyl)adipate to 150 parts of ethylene glycol, stir at 110°C for 5 minutes, then add 6 parts of 3 -Tridecafluorohexylpropene, 10 parts of N-(3-hydroxyphenyl)acetamide, adjust the temperature to 120°C, stir for 35 minutes, then add 0.6 parts of glutaryl hydrazide and 1.1 parts of 4-tert-butylphenylacetylene, Stir for 2 hours; Add 6 parts of alumina again; Stir for 85 minutes to obtain epoxy material;

[0023] (2) In terms of parts by mass, mix 15 parts of graphene and 1 part of polyvinylpyrrolidone to obtain pretreated graphene; add 18 parts of N-acetyl p-aminophenol to 20 parts of ethanol, stir and mix for 40 minutes, and then Add 4 parts of silicon nitride, mix for 1 hour, then add the above-mentioned pretreated graphene, and stir at 50°C for 25 minutes to obtain a filler mixture;

[0024] (3) In parts by mass, add 1 part of the filler mixture prepared in step (2) to 6 parts of epoxy material prepared in...

Embodiment 3

[0026] (1) In parts by mass, add 100 parts of bis((3,4-epoxycyclohexyl)methyl)adipate to 150 parts of ethylene glycol, stir at 110°C for 5 minutes, then add 6 parts of 3 -Tridecafluorohexylpropene, 10 parts of N-(3-hydroxyphenyl)acetamide, adjust the temperature to 120°C, stir for 35 minutes, then add 0.6 parts of glutaryl hydrazide and 1.1 parts of 4-tert-butylphenylacetylene, Stir for 2 hours; Add 6 parts of alumina again; Stir for 85 minutes to obtain epoxy material;

[0027] (2) In terms of parts by mass, mix 15 parts of graphene and 1 part of polyvinylpyrrolidone to obtain pretreated graphene; add 18 parts of N-acetyl p-aminophenol to 20 parts of ethanol, stir and mix for 40 minutes, and then Add 4 parts of silicon nitride, mix for 1 hour, then add the above-mentioned pretreated graphene, and stir at 50°C for 25 minutes to obtain a filler mixture;

[0028] (3) In parts by mass, add 1 part of the filler mixture prepared in step (2) to 7 parts of epoxy material prepared in...

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Abstract

The invention relates to a high thermal conductive and insulating material and a preparation method thereof.Bis((3,4-epoxy cyclohexyl)methyl)adipate is added into ethylene glycol, 3-tridecafluoro hexyl propylene and N-(3-hydroxyphenyl)acetamide are added, stirring is performed, then, glutaryl hydrazide and 4-tert-butyl benzene acetylene are added, and stirring is performed; then, aluminum oxide is added; stirring is performed to obtain an epoxy material; graphene and polyvinyl pyrrolidone are mixed to obtain preprocessed graphene; N-acetyl p-aminophenol is added into ethyl alcohol, then, silicon nitride is added, the preprocessed graphene is added, and stirring is performed to obtain a filler mixture; the filter mixture is added into the epoxy material; stirring is performed, then, thiocyanato-1-(2-aminophenyl)ethanone is added, stirring is performed for 3 h, a solvent is removed, and the high thermal conductive and insulating material is obtained; the high thermal conductive and insulating material is placed into a mold, and thermocuring is performed to obtain thermal conductive and insulating materials of different specifications.According to the preparation method, raw materials are wide in source, the preparation process is simple and controllable, only normal operation is needed, and industrialization is easy.

Description

technical field [0001] The invention belongs to the technical field of insulating materials, and in particular relates to a high thermal conductivity insulating material and a preparation method thereof. Background technique [0002] Composite materials are important basic materials for high-tech fields such as information technology, biotechnology, and energy technology, and for national defense construction. They also play a very important role in transforming traditional industries such as agriculture, chemical industry, and building materials. There are many types of composite materials and they are widely used. Electronic composite materials in China are forming a large-scale high-tech industrial group, which has very broad market prospects and extremely important strategic significance. Thermally conductive materials are widely used in the field of electronic equipment, especially plate materials, which are widely used in electronic heat exchange devices, electronic in...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08K13/06C08K9/04C08K3/04C08K3/34C08K3/22
CPCC08K13/06C08K3/04C08K3/22C08K3/34C08K9/08C08K2003/2227C08K2201/003C08K2201/006C08L2201/08C08L2203/20C08L63/00
Inventor 孙政良
Owner SUZHOU JIN TENG ELECTRONICS TECH
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