Hot-melt glue film for combining polypropylene cellular boards and preparing method of hot-melt glue film
A polypropylene honeycomb panel, hot melt adhesive film technology, applied in the direction of adhesives, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of poor film formation, inability to guarantee performance, slow casting film speed, etc. Achieve the effect of improving low temperature flexibility, solving low temperature cracking, and improving adhesive strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
preparation example Construction
[0022] The preparation method of the hot-melt adhesive film for polypropylene honeycomb board composite, 40%~70% of low melting point ternary copolymerized polypropylene, 20%~40% of ethylene-propylene or ethylene-butene copolymer, 5%~ 20% of C5 / C9 copolymer resin, 2%~15% of high molecular weight PP wax and 1‰~2‰ of antioxidant are placed in the kneader for banburying treatment. After the system melts, add the total amount in four times It is a closed silane adhesion promoter of 2‰~8‰ and kneaded. After kneading for 5~8 minutes, the material is discharged and subjected to water ring granulation to make hot melt rubber particles. The hot melt rubber particles are passed through a screw extruder Casting treatment after extrusion is made into hot melt adhesive film.
[0023] Wherein, the amount of the blocking silane adhesion promoter added each time is the same.
Embodiment 1
[0025] Hot-melt adhesive film for polypropylene honeycomb panel composite, including the following materials by weight fraction: 50% low melting point terpolymer polypropylene, 30% ethylene-propylene or ethylene-butylene copolymer, 15% C5 / C9 Copolymer resin, 5‰ closed silane adhesion promoter and 2‰ antioxidant. The balance is high molecular weight PP wax.
Embodiment 2
[0027] Hot-melt adhesive film for polypropylene honeycomb panel composite, including the following materials by weight fraction: 70% low melting point terpolymer polypropylene, 20% ethylene-propylene or ethylene-butylene copolymer, 5% C5 / C9 Copolymer resin, 8‰ closed silane adhesion promoter and 1‰ antioxidant. The balance is high molecular weight PP wax.
PUM
Property | Measurement | Unit |
---|---|---|
melting point | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com