Integrated illuminating and irradiating structure

Abstract

An integrated illuminating and irradiating structure comprises a radiating member, a PCB, LED chips and an adhesive layer, the radiating member comprises a body, and a reflection layer is arranged on the surface of the body. The LED chips are arranged on the reflection layer, and the PCB is equipped with a plurality of hollow parts and is arranged on the reflection layer of the radiating member. The adhesive layer is arranged between the PCB and the reflection layer, and the LED chips are accommodated in the hollow parts correspondingly and are electrically connected with the PCB. In the above integrated illuminating and irradiating structure, the LED chips are connected with the radiating member directly, so that the heat can be radiated out from the radiating member directly. Moreover, the reflection layer is arranged on the surface of the radiating member, when the LED chips emit light, on one hand, the reflection layer can reflect out the light rays which are irradiated on the reflection layer, so that the light rays are prevented from irradiating on the surface of the radiating member to generate a lot of heat and influence a heat radiation effect; on the other hand, the reflection layer enables the illumination effect of the integrated illuminating and irradiating structure to be improved.

Description

Technical field [0001] The invention relates to a lighting device, in particular to an integrated lighting and irradiation structure. Background technique [0002] The heat dissipation level of the LED chip is directly related to the light attenuation or the length of the life of the LED chip. At present, in the fields of high-power lighting and special high-power industrial illumination, the heat dissipation of LED chips is often first transferred from the LED chip to the carrier of the sealed lamp beads, and then to the printed circuit board (PrintedCircuitBoard) carrier, and then by The PCB board is transferred to the heat sink, and the heat is dissipated by the heat sink. Therefore, the entire heat dissipation process needs to be conducted multiple times, and the thermal conductivity of the thermally conducted components is different each time, which is not conducive to the heat dissipation of the LED chip in high-power lighting and special high-power industrial illumination...

AI Technical Summary

Problems solved by technology

Therefore, the entire heat dissipation process has to pass through multiple conductions, and the heat conduction coefficient of each heat conduction element is different, which is not conducive to the heat dissipation of LED chips in high-power lighting and special high-power industrial irradiation, so the heat dissipation efficiency of the above-mentioned LED chips is low.

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