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A kind of polyimide nanocomposite material containing naphthalene structure and its preparation method and application

A technology of nanocomposite materials and polyimide, which is applied in the field of material science to achieve the effect of simple preparation process, various preparation processes and low condition requirements

Active Publication Date: 2018-03-27
江西有泽新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is still little research on high-barrier polyimide and its nanocomposites with a high planar structure. Therefore, it is necessary to carry out research on such polyimide nanocomposites.

Method used

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  • A kind of polyimide nanocomposite material containing naphthalene structure and its preparation method and application
  • A kind of polyimide nanocomposite material containing naphthalene structure and its preparation method and application
  • A kind of polyimide nanocomposite material containing naphthalene structure and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037]At room temperature, under argon atmosphere, 0.20g mica (Mica) was sonicated in (41ml) N,N-dimethylformamide for 1h, and then 3.1040g (0.01mol) 4,4'-(naphthalene-2 ,7-diyl)dianiline (NPDA) and 2.1812g (0.01mol) 1,2,4,5-Benzenetetracarboxylic anhydride (1,2,4,5-pyromellitic dianhydride, PMDA) were added to N,N- In dimethylformamide, the solid content was 15%, and the reaction was stirred for 6 hours to obtain a homogeneous and viscous polyamic acid / mica composite glue. Scrape-coat the polyamic acid / mica composite glue on the glass plate, then place the glass plate in a vacuum oven and vacuumize. The temperature rise program is: the room temperature is raised to 100°C, and then the temperature is kept constant for 1h→100°C to 200°C. After constant temperature, the whole process is 1h→200°C and the temperature is raised to 300°C. The whole process of constant temperature is 1h→300°C, and the temperature is raised to 400°C. The infrared spectrogram of the polyimide composit...

Embodiment 2

[0040] At room temperature, under an argon atmosphere, 0.18g of montmorillonite (MMT) was sonicated in (73.1ml) N,N-dimethylformamide for 2h, and 5.4865g (0.01mol) of N 1 ,N 4 -bis(3'-amino-[1,1'-biphenyl]-4-yl)terephthalamide(NADPA) and 2.1812g(0.01mol)1,2,4,5-Benzenetetracarboxylic anhydride(1,2,4,5 -Pyromellitic dianhydride, PMDA) was added to N,N-dimethylformamide with a solid content of 30%, and stirred for 6 hours to obtain a homogeneous and viscous polyamic acid / montmorillonite composite glue. Scrape-coat the polyamic acid / montmorillonite composite glue on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the temperature rise program is: the room temperature is raised to 100°C, and then the temperature is kept constant throughout the process for 1h→100°C to After 200°C, keep the temperature for 1h→200°C to 300°C, keep the temperature for 1h→300°C to 400°C, then keep the temperature for 1h. After cooling, the polyimide / montmorillonite composit...

Embodiment 3

[0043] At room temperature, under an argon atmosphere, 0.03g graphene oxide (GO) was ultrasonicated in (46ml) N-methylpyrrolidone for 6h to obtain a graphene oxide dispersion. At the same time, 4.5856g (0.01mol) 4,4' -(((naphthalene-2,7-diylbis(oxy))-bis-(butane-4,1-diyl))-bis(oxy))dianiline(NOC 3 OPA) and 2.1812g (0.01mol) 1,2,4,5-Benzenetetracarboxylic anhydride (1,2,4,5-pyromellitic dianhydride, PMDA) were added to N-methylpyrrolidone with a solid content of 10 %, stirring and reacting for 6 hours to obtain a homogeneous and viscous polyamic acid glue, and then pour the graphene oxide dispersion into the polyamic acid glue to obtain a polyamic acid / graphene oxide composite glue. Scrape-coat the polyamic acid / graphene oxide composite glue on the glass plate, then place the glass plate in a vacuum oven, vacuumize, and the temperature rise program is: the room temperature is raised to 100°C and then the temperature is kept constant for 1h→100°C to After 200°C, the whole proce...

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Abstract

The invention discloses a polyimide nanocomposite of a naphthalene structure and a preparation method and application of the polyimide nanocomposite. According to the composite, aromatic-diamine which has high planarity and of the naphthalene structure, various types of tetracarboxylic dianhydride and layered nanoparticles are adopted as raw materials; in the argon atmosphere, the layered nanoparticles are dispersed in strong-polarity nonprotic organic solvent, then diamine and dianhydride are added to dispersing liquid, stirring and a reaction are conducted, and a polyamide acid composite adhesive solution is obtained; or while the layered nanoparticles are dispersed, the diamine and the dianhydride are placed into another container for preparing polyamide acid, then nanoparticle dispersing liquid and the polyamide acid are mixed, and the composite adhesive solution is obtained; finally, the composite adhesive solution is dehydrated, and the polyimide nanocomposite is obtained. According to the polyimide nanocomposite, polyimide molecular chains of the type contain naphthalene nucleuses which are good in planarity and high in rigidity, the prepared nanocomposite has excellent thermal stability and barrier performance in combination with the enhancement effect of the layered nanoparticles, and the polyimide nanocomposite and the preparation method and application of the polyimide nanocomposite can be widely applied to fields of high-performance packaging, electronic device packaging and the like.

Description

technical field [0001] The invention relates to the field of material science, in particular to a polyimide nanocomposite material containing a naphthalene structure and a preparation method and application thereof. technical background [0002] Flexible polymer films with excellent barrier properties are very important in the fields of packaging and protection, as well as electronic device encapsulation, especially in the field of flexible organic electronic devices, such as organic electroluminescent devices (OLEDs) and polymer solar cells (PSCs). . This is due to the fact that the performance, efficiency, and lifetime of OLEDs and PSCs largely depend on the properties of flexible polymer films, i.e. encapsulation materials. In order to ensure the normal use of devices, packaging materials are usually required to have excellent barrier properties, excellent heat resistance, and dimensional stability. Polyimide (PI) has excellent properties unmatched by other flexible pol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10C08J5/18C08K3/34C08K3/04C08K3/26
CPCC08G73/1003C08G73/1007C08G73/1067C08G73/1071C08J5/18C08J2379/08C08K3/04C08K3/26C08K3/34C08K3/346
Inventor 刘亦武曾义谭井华柳俊杰彭思梅汪文涛黄杰陈洪
Owner 江西有泽新材料科技有限公司
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