Micro-glass hemispherical resonator gyro and wafer level preparation method thereof
A technology of micro-glass hemisphere and resonant gyroscope, which is applied in the direction of gyroscope/steering sensing equipment, gyro effect for speed measurement, microstructure technology, etc., can solve the problems of high cost and difficulty of hemispherical resonant gyroscope, reduce volume cost, solve Electrode alignment issues, effects of increased capacitance
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[0071] The wafer-level preparation of micro glass hemispherical resonators by thermal foaming process includes the following steps:
[0072] Step one, see Figure 1a , dry etching the silicon wafer to form a silicon mold wafer 1, so that a cylindrical cavity 3 containing a silicon cylinder 4 is formed in the silicon mold wafer 1, and a foaming agent 2 is added to the cylindrical cavity 3; wherein, The thickness of the silicon wafer is not less than 300um; the dry etching is deep reactive ion etching, and the etching depth is less than 100um thicker than the thickness of the highly doped silicon wafer; the foaming agent is a substance that can release gas at high temperature, and TiH can be used 2 , but not limited to TiH 2 ;
[0073] Step two, see Figure 1b A glass wafer 5 is bonded to the upper surface of the silicon mold wafer 1 in step 1 and the upper surface of the silicon cylinder 2 in the cylindrical cavity 3 to form a bonded wafer; wherein the thickness of the glass...
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