Cutting Force Prediction Method for Ultrasonic Vibration Side Grinding of Brittle Materials

A technology of cutting force prediction and ultrasonic vibration, which is applied to the control of parts of grinding machine tools, grinding/polishing equipment, and workpiece feed movement, and can solve problems such as not being able to reflect processing conditions

Inactive Publication Date: 2017-08-29
NANJING UNIV OF SCI & TECH
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to solve the problem that the existing cutting force prediction method fails to consider the plastic flow removal stage of the material and assumes that all abrasive particles participate in the cutting process at the same time, which cannot reflect the real processing status, and proposes a method for ultrasonic vibration side grinding of brittle materials The prediction method of cutting force realizes the accurate prediction of cutting force in the process of ultrasonic vibration side grinding of brittle materials

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Cutting Force Prediction Method for Ultrasonic Vibration Side Grinding of Brittle Materials
  • Cutting Force Prediction Method for Ultrasonic Vibration Side Grinding of Brittle Materials
  • Cutting Force Prediction Method for Ultrasonic Vibration Side Grinding of Brittle Materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0030] In order to better understand the technical content of the present invention, specific embodiments are given together with the attached drawings for description as follows.

[0031] The cutting force prediction method for ultrasonic vibration side grinding of brittle materials of the present invention is suitable for ultrasonic vibration side grinding of brittle materials such as ceramics and glass. In this embodiment, ultrasonic vibration side grinding of zirconia ceramics is taken as an example. Its processing form is as figure 2 As shown, the tool used is a diamond abrasive tool, the tool rotates with the spindle and vibrates at an axial ultrasonic frequency, and the tool performs a feed motion. In the figure, the number 1 represents diamond abrasive grains, the specific parameters of diamond abrasive grain cutters, the main performance parameters and vibration parameters of zirconia ceramics are shown in Table 1 below.

[0032] Table 1

[0033] Grit size...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a prediction method of cutting force of ultrasonic vibration side face grinding of a brittle material. By analyzing the movement track and the cutting surface morphology of a single abrasive grain, the critical cutting depth and the maximum cutting depth which are generated when plastic-brittle conversion happens in a single rotating period are determined, and therefore average cutting depth and average cutting force in the plastic flow eliminating stage and in the brittle breakage eliminating stage can be determined; contrastive analysis is performed on the practical eliminating volume of all abrasive grains and the theoretical eliminating volume of the single abrasive grain, and the number of effective abrasive grains participating in processing is determined; and influences of tool abrasion, cutting temperature and machine tool stiffness are comprehensively considered and a comprehensive influence coefficient K is introduced, a prediction model of cutting force F is established, a prediction model of final cutting force F is established, and cutting force generated under different processing parameters is predicted. By means of the prediction method, the prediction result conforms to the actual processing conditions better, and prediction precision of the cutting force of ultrasonic vibration side face grinding of the brittle material can be remarkably improved.

Description

technical field [0001] The invention relates to the field of ultrasonic vibration grinding processing, in particular to a cutting force prediction method for ultrasonic vibration side grinding of brittle materials. technical background [0002] Brittle materials such as ceramics have the advantages of good wear resistance, corrosion resistance, biocompatibility and high temperature thermal stability, so they are widely used in the fields of aerospace, precision instruments and medical repair. But at the same time, the characteristics of high hardness and low fracture toughness of this kind of material determine that its processing process is relatively difficult. Therefore, in the prior art, ultrasonic vibration side grinding technology is usually used to realize the processing of brittle materials, so as to improve the processing efficiency and processing quality of brittle materials. [0003] In the process of ultrasonic vibration side grinding of brittle materials, the c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): B24B1/04B24B49/00
CPCB24B1/04B24B49/00
Inventor 郑侃肖行志廖文和孟恒
Owner NANJING UNIV OF SCI & TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products