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Hypersonic speed aircraft skin cooling and semiconductor thermoelectric power generation integrated system

A hypersonic, thermoelectric power generation technology, applied in the directions of generators/motors, electrical components, etc., can solve the problems of aircraft surface thermal protection aircraft power supply, etc., and achieve the effect of lowering temperature, lowering quality and high reliability

Inactive Publication Date: 2016-04-20
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide an integrated system for hypersonic aircraft skin cooling and semiconductor thermoelectric power generation in order to solve the problem of thermal protection of the aircraft surface and the power supply of the aircraft during long-endurance hypersonic flight

Method used

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  • Hypersonic speed aircraft skin cooling and semiconductor thermoelectric power generation integrated system

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specific Embodiment approach 1

[0015] Specific implementation mode 1: Combination figure 1 To illustrate this embodiment, the hypersonic aircraft skin cooling and semiconductor thermoelectric power generation integrated system described in this embodiment includes a skin 1, a semiconductor thermoelectric power generation module 9, two thermally conductive insulating layers 4, a fuel channel 6 and a Root wire 7;

[0016] The semiconductor thermoelectric power generation module 9 is fixed between two thermally conductive insulating layers 4, one side of the skin 1 is fixed on the outside of a thermally conductive insulating layer 4, the other side of the skin 1 is the heat flow 10; the fuel channel 6 is fixed on one side On the outside of the other thermally conductive insulating layer 4; the fuel channel 10 is used to circulate lower temperature fuel;

[0017] The semiconductor thermoelectric power generation module 9 is composed of M P-type semiconductor thermoelectric materials 2, M N-type semiconductor thermo...

specific Embodiment approach 2

[0023] Embodiment 2: This embodiment further defines the hypersonic aircraft skin cooling and semiconductor thermoelectric power generation integrated system described in Embodiment 1. In this embodiment, M P-type semiconductor thermoelectric materials 2 and M The N-type semiconductor thermoelectric materials 3 are all made of lead telluride. Lead telluride is a polar compound, which is a typical semiconductor. It has significant infrared photoconductivity and is a good thermoelectric material.

specific Embodiment approach 3

[0024] Specific embodiment three: This embodiment further defines the hypersonic aircraft skin cooling and semiconductor thermoelectric power integrated system described in the second embodiment. In this embodiment, M P-type semiconductor thermoelectric materials 2 and M The operating temperature range of the N-type semiconductor thermoelectric material 3 is 300°C-600°C.

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Abstract

The invention discloses a hypersonic speed aircraft skin cooling and semiconductor thermoelectric power generation integrated system, relating to a hypersonic speed aircraft skin cooling and semiconductor thermoelectric power generation integrated technology, and aiming to realize the effects of surface thermal protection and aircraft power supply of an aircraft flying at a hypersonic speed during long term voyage. According to the system, a semiconductor thermoelectric power generation module is fixed between two heat conduction insulating layers, one side of the skin is fixed at the outer side of one heat conduction insulating layer, and a heat flow is at the other side of the skin; one side of a fuel passage is fixed at the outer side of another heat conduction insulating layer, the anode of the semiconductor thermoelectric power generation module is connected with one end of a load by a lead, and the cathode of the semiconductor thermoelectric power generation module is connected with the other end of the load by a lead; M is a positive integer. The hypersonic speed aircraft skin cooling and semiconductor thermoelectric power generation integrated system has the beneficial effects that a skin cooling system and a power generation system are combined into a whole, the semiconductor thermoelectric power generation module is adopted for power generation, and the integrated system is simple in structure, free of rotating parts, small in vibration, high in reliability and suitable for electronic parts for radars, navigation and the like.

Description

Technical field [0001] The invention relates to an integrated technology of hypersonic aircraft skin cooling and semiconductor thermoelectric power generation. Background technique [0002] Hypersonic aircraft flying under high flying Mach number, its surface will generate high temperature due to aerodynamic heating, if not handled properly, the aircraft will be severely ablated, which makes the thermal protection of aircraft skin a key technology for hypersonic flight one. At the same time, for long-endurance hypersonic aircraft, a single battery can no longer meet the power supply needs, and a power supply system that can continue to generate electricity must be introduced. [0003] When an aircraft flies in the atmosphere at hypersonic speeds, the air receives strong compression and friction, and most of the kinetic energy is converted into heat energy, which causes the air to rise sharply in temperature, so that heat is quickly transferred to the surface of the aircraft. This...

Claims

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Application Information

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IPC IPC(8): H02N11/00
CPCH02N11/002
Inventor 秦江程昆林常军涛张铎鲍文
Owner HARBIN INST OF TECH
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