Fully wafer-level packaged mems microphone and manufacturing method thereof

Abstract

The present invention provides a method for manufacturing a fully wafer-level packaged MEMS microphone and the manufactured microphone. The method includes: respectively manufacturing a first packaged chip, a MEMS microphone chip and a second packaged chip; Wafer-to-wafer bonding to form a plurality of fully wafer-level packaged MEMS microphone units; dicing the fully wafer-level packaged MEMS microphone units to form a plurality of fully wafer-level packaged MEMS microphones fully in Packaging is performed at the wafer level and does not require any further processing after wafer dicing. The method can improve cost-effectiveness, performance consistency, manufacturability, quality, scalability of the packaged MEMS microphone.

Description

technical field [0001] The present invention relates to the technical field of microphones, more specifically, to a packaged MEMS microphone and a manufacturing method thereof. Background technique [0002] Silicon-based MEMS (micro-electro-mechanical systems) microphones, also known as acoustic transducers, are playing an increasingly important role in hearing aids, mobile communication systems, digital still and video cameras, and in the toy industry. Typically, silicon-based MEMS microphone chips need to be packaged before they can be tested, shipped and used. US Patent 6,781,231 discloses a method such as figure 1 A typical MEMS package is shown, which includes a surface-mountable component 12 (e.g., a silicon-based MEMS microphone chip, an integrated circuit), a substrate 14, and a cover 20, wherein the substrate 14 and cover 20 are combined to form a housing 22 , the surface-mountable component 12 is located in the housing 22 and electrically connected. [0003] How...

AI Technical Summary

Problems solved by technology

In particular, when the package size is further reduced according to the trend, the package cost will become the bottleneck of cost reduction

Second, it is not conducive to manufacturing and mass production, because a single MEMS microphone chip needs to be individually packaged

Third, performance consistency cannot be guaranteed, and particle and organic pollution are not easy to avoid

Fourth, due to the non-compact structure of this MEMS package, its size reduction is greatly limited

However, this U.S. patent application only discloses the chip structure of the MEMS microphone and the wafer process flow for manufacturing the structure, which is not actually a packaged MEMS microphone that can be surface-mounted, and still requires traditional acoustics after the wafer process. encapsulation

Therefore, fully wafer-level packaged MEMS microphones, which are fully packaged at the wafer level and do not require any further processing after wafer dicing, and methods of manufacturing the same remain unapplied.

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