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Radiating method, radiating structure and radiating part for electronic equipment

A technology for electronic equipment and heat-dissipating components, applied in the field of heat-dissipating structures and heat-dissipating components, can solve the problem that the heat-dissipating effect needs to be improved, and achieve the effects of improving the heat-dissipating capacity and efficiency, improving the expansion effect, and having a strong thermal expansion effect.

Inactive Publication Date: 2016-04-13
YUNNAN KEWEI LIQUID METAL VALLEY R & D CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] Of course, the above only takes mobile phones as an example, and there are also problems that the heat dissipation effect needs to be improved in other small sealed electronic devices such as mobile phones, such as tablet computers

Method used

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  • Radiating method, radiating structure and radiating part for electronic equipment
  • Radiating method, radiating structure and radiating part for electronic equipment
  • Radiating method, radiating structure and radiating part for electronic equipment

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Embodiment Construction

[0033] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] Heat dissipation component for electronic equipment of the present invention

[0035]The heat dissipation component 1 for electronic equipment of the present invention is provided with the heat dissipation structure for electronic equipment of the present invention. A part of the closed flow path corresponds to the heat source setti...

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Abstract

The invention relates to a radiating method, a radiating structure and a radiating part for electronic equipment. According to the radiating method, low-boiling-point liquid-state working medium and liquid-state elementary substance metal / metal alloy are adopted to absorb heat from a heating source in the electronic equipment, wherein the low-boiling-point liquid-state working medium and the liquid-state elementary substance metal / metal alloy are insoluble and non-reactive mutually; the gas generated by heat absorption and gasification of the low-boiling-point liquid-state working medium is used for driving the liquid-state elementary substance metal / metal alloy to flow; and the liquid-state elementary substance metal / metal alloy transfers heat to a radiating part of the electronic equipment in the flowing process. The radiating structure comprises a circulating sealed flowing channel arranged in the radiating part of the electronic equipment, wherein the circulating sealed flowing channel is used for accommodating the low-boiling-point liquid-state working medium and the liquid-state elementary substance metal / metal alloy; and the radiating part comprises the radiating structure. The heated and gasified low-boiling-point liquid-state working medium provides strong power for driving the liquid-state elementary substance metal / metal alloy to flow; and due to the efficient heat convection and heat exchange capability of the liquid-state elementary substance metal / metal alloy, the heat convection energy is radiated, so that the radiating efficiency of the electronic equipment is improved.

Description

technical field [0001] The invention relates to the field of heat dissipation of electric equipment, in particular to a heat dissipation method, a heat dissipation structure and a heat dissipation component for electronic equipment. Background technique [0002] Mobile phones are essential electronic devices in modern life. With the increasingly powerful functions of mobile phones and the continuous improvement of computing requirements, the heating problem is becoming more and more serious. The heating of the mobile phone will cause discomfort to the human body and reduce the user experience. Local overheating of mobile phones will reduce the efficiency and life of electronic components, and even cause irreversible damage to the components. Therefore, reliable thermal management and thermal design are very important for the safety, efficiency and comfort of mobile phones. [0003] Specifically, the main heat source of a mobile phone is the processor, which tends to be sm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20272H05K7/20245
Inventor 杨小虎刘静邓中山
Owner YUNNAN KEWEI LIQUID METAL VALLEY R & D CO LTD
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