A two-dimensional photonic crystal electromagnetic radiation protection device with isi structure

Abstract

The invention belongs to the technical field of electromagnetic protection, and relates to a two-dimensional photonic crystal electromagnetic radiation protection device with an insulator-semiconductor-insulator (ISI) structure. The whole ISI structure is arranged between a camouflage layer and an adhesive layer, and is a single-layer, dual-layer or multi-layer ISI photonic crystal structure; the ISI photonic crystal structure comprises an upper-layer insulator, semiconductor dielectric cylinders, middle insulators and a bottom-layer insulator; the semiconductor dielectric cylinders which are uniformly distributed are arranged between the upper-layer insulator and the bottom-layer insulator; spaces among the semiconductor dielectric cylinders are filled with the middle insulators; and the semiconductor dielectric cylinders are greater than 2mm in heights, and greater than 5mm in thicknesses. The two-dimensional photonic crystal electromagnetic radiation protection device has the characteristics of simple structure, explicit mechanism, novel content, reasonable design, mature machining and compositing technologies, low cost and good radiation protection effect.

Description

Technical field: [0001] The invention belongs to the technical field of electromagnetic protection, and relates to a novel ISI (insulator-semiconductor-insulator, insulator-semiconductor-insulator) structure two-dimensional photonic crystal electromagnetic radiation protection device, in particular to a two-dimensional, soft, replaceable photonic crystal Crystal structure, in the middle is a dielectric column scattering element constructed of high refractive index materials, surrounded by soft materials with low refractive index filled and surrounded, according to the electromagnetic wave mode (TE or TM), it is a single-layer, double-layer or multi-layer ISI structure. It has a wide photonic band gap and can be combined with other protections such as anti-corrosion, which is convenient for practical application. Background technique: [0002] At present, communication equipment such as radars and antennas, as well as weapons and equipment such as tanks, are all painted with ...

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Problems solved by technology

[0002] At present, communication equipment such as radars and antennas, as well as weapons and equipment such as tanks, are all painted with camouflage paint or covered with camouflage clothing to achieve the purpose of anti-corrosion and anti-detection. However, there are still the following problems: First, communication equipment such as radars and antennas The base of the base will absorb the emitted electromagnetic waves to a certain extent, thereby affecting its emission efficiency, especially when there are metal materials on some bases, the impact is great; the second is some precision instruments, such as signal sources, sensors and microwave communications, etc. , it is necessary to prohibit the interference of some special frequency electromagnetic waves (electromagnetic waves similar to the working frequency of the instrument), but sometimes it cannot be effectively shielded; the third is that after tanks, artillery and other weapons are equipped with camouflage paint or covered with camouflage clothing, they should not be found by the naked eye. However, it is still difficult for them to avoid the tracking of special electromagnetic instruments. When the temperature rises when they are moving or firing shells, their infrared radiation is strengthened, so they are easily detected by special electromagnetic instruments.

However, in current research, except for some two-dimensional or three-dimensional antenna structures, other structures are mostly one-dimensional thin-layer structures, which exist: narrow operating bandwidth; small power capacity; unsatisfactory loss reduction; many structures only consider the TE or TM of electromagnetic waves mode), without considering the two together; mostly for one-time use, unable to deform with different devices; without considering the impact of practical issues such as material thickness and coverage

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