Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

3D printer set for quickly manufacturing PCB (printed circuit board)

A printer group, 3D technology, applied in typewriters, printing devices, printing and other directions, can solve the problems of long PCB production cycle, low material utilization rate, expensive investment, etc., to save the total process time, high investment cost, and land occupation. large area effect

Inactive Publication Date: 2016-03-30
TIANJIN XITONG ELECTRONICS EQUIP CO LTD
View PDF9 Cites 26 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the traditional etching and screen printing method is mainly used in the manufacture of printed circuit boards (PCB); this method involves dozens of equipment, complex structure and expensive investment, and requires professionals to operate; PCB board production cycle is long, It usually takes several days or even longer; there are dozens of processes in the production process, and the discharge includes copper, toxic wastewater, ammonia nitrogen and other pollutants; the utilization rate of materials is low, and various raw materials are wasted to varying degrees in the production process, and high energy consumption

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • 3D printer set for quickly manufacturing PCB (printed circuit board)
  • 3D printer set for quickly manufacturing PCB (printed circuit board)
  • 3D printer set for quickly manufacturing PCB (printed circuit board)

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] In order to further understand the invention content, characteristics and effects of the present invention, the following examples are given, and detailed descriptions are as follows in conjunction with the accompanying drawings:

[0026] A 3D printer unit for rapid PCB manufacturing, including a drilling needle device 1, an inkjet character device 2, and a pressing device 3. The above three devices are all placed on a level ground and combined to form a 3D printer unit. The specific placement position It can be arranged arbitrarily according to actual needs.

[0027] see figure 1 and figure 2 , the drilling needle equipment 1 includes a drilling needle chassis 101 and a three-dimensional driving device for the drilling needle. The top of the drilling needle cabinet is the drilling needle workbench 102, the upper surface of the drilling needle workbench is installed with the drilling needle substrate 103 for placing the PCB board, and the drilling needle workbench Y...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a 3D printer set for quickly manufacturing a PCB (printed circuit board). The 3D printer set comprises three-dimensional drilling spray needle equipment, three-dimensional ink-jet character equipment and three-dimensional press fit equipment. Novel 3D printing equipment based on a digital inkjet technology uses materials such as nano liquid metal, photosensitive resin and the like to manufacture the PCB. The 3D printer set is integrated with punching, silver depositing, line spraying, coating and lettering, so that the whole producing and manufacturing process of the PCB can be completed by only needing one set of equipment, and therefore, the producing process is greatly simplified; ink-jet printing speed is greater than electroplating and etching speed by more than 20 times, so that total process time is saved by more than 60%, producing and manufacturing time is greatly shortened, and reliability is also remarkably improved; functional printing ink is used for jet printing so as to obtain a printed line, a resistance welding layer and a character layer for manufacturing the PCB, and therefore, a material utilization rate is close to 100%, energy consumption is lower, cost is lower, and green production is realized; and the functional printing ink is adopted to directly carry out jet printing on an insulated base plate so as to obtain the printed line, the resistance welding layer and the character layer, so that a printing ink utilization rate is close to 100%, and almost no-pollution emission is realized.

Description

technical field [0001] The invention belongs to the technical field of PCB manufacturing, in particular to a 3D printer assembly for rapid PCB manufacturing. Background technique [0002] At present, the traditional etching and screen printing method is mainly used in the manufacture of printed circuit boards (PCB); this method involves dozens of equipment, complex structure and expensive investment, and requires professionals to operate; PCB board production cycle is long, It usually takes several days or even longer; there are dozens of processes in the production process, and the discharge includes copper, toxic wastewater, ammonia nitrogen and other pollutants; the utilization rate of materials is low, and various raw materials are wasted to varying degrees in the production process, and High energy consumption. Contents of the invention [0003] In order to solve the technical problems in the known technology, the present invention provides a PCB rapid manufacturing ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B41J2/01B41J3/407B41J3/44B41J11/00B32B37/06B32B37/10B22F3/115
CPCB22F3/115B32B37/06B32B37/10B41J2/01B41J3/4073B41J3/44B41J11/002
Inventor 汤晓宇谭诚
Owner TIANJIN XITONG ELECTRONICS EQUIP CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products