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Thermal conductive member and preparation method thereof

A technology of heat-conducting components and heat-conducting layers, applied in chemical instruments and methods, modification through conduction heat transfer, cooling/ventilation/heating transformation, etc., can solve problems such as low installation accuracy and difficult disassembly and assembly of heat-conducting gaskets, and achieve friction Small resistance, guaranteed installation accuracy, convenient installation and adjustment

Inactive Publication Date: 2016-03-16
PINGHU ALLIED IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a heat-conducting member and its preparation method, which can solve the problems of difficult assembly and disassembly of existing heat-conducting gaskets and low installation accuracy

Method used

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  • Thermal conductive member and preparation method thereof

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Effect test

Embodiment 1

[0030] A heat-conducting member, the non-adhesive layer comprises the following components by mass: 60 parts by mass of a phase change material, 450 parts by mass of an Al filler with a particle size of 20 μm, and 200 parts by mass of a ZnO filler with a particle size of 2 μm;

[0031] The conductive layer comprises the following components by mass: 14.5 parts by mass of polysiloxane, 26 parts by mass of Al with a particle size of 5 μm 2 o 3 and 50 parts by mass of Al with a particle size of 40 μm 2 o 3 .

[0032] A method for preparing a heat conducting member, comprising the following steps:

[0033] Step 1: The phase change material, the Al filler with a particle size of 20 μm, and the ZnO filler with a particle size of 2 μm were stirred and mixed by planetary stirring to form a mixture. The stirring temperature was 110° C. and the stirring time was 120 minutes;

[0034] Step 2: The mixture prepared in step 1 is calendered to form a non-adhesive layer, and the thickness...

Embodiment 2

[0039] A heat conducting member as described in Embodiment 1, this embodiment has the following differences: the non-adhesive layer includes the following components by mass: 20 parts by mass of phase change material, 300 parts by mass of Al filler with a particle size of 5 μm and 100 parts by mass of Al with a particle size of 0.5 μm 2 o 3 filler;

[0040] The conductive layer comprises the following components by mass: 10 parts by mass of polysiloxane, 10 parts by mass of Al with a particle size of 5 μm and 90 parts by mass of Al with a particle size of 25 μm 2 o 3 .

[0041] A method for preparing a heat conducting member, comprising the following steps:

[0042] Step 1: The phase change material, the Al filler with a particle size of 5 μm, and the Al filler with a particle size of 0.5 μm 2 o 3 The filler is stirred and mixed by planetary stirring to form a mixture, the stirring temperature is 150°C, and the stirring time is 180 minutes;

[0043] Step 2: The mixture ...

Embodiment 3

[0048] A heat conduction member as described in Embodiments 1 and 2. This embodiment has the following difference: the non-adhesive layer includes the following components by mass: 50 parts by mass of phase change material, 500 parts by mass of Al filler and 200 parts by mass of ZnO filler with a particle size of 0.5 μm;

[0049] The conductive layer comprises the following components by mass: 15 parts by mass of polysiloxane, and 50 parts by mass of AlN with a particle size of 40 μm.

[0050] A method for preparing a heat conducting member, comprising the following steps:

[0051] Step 1: The phase change material, the Al filler with a particle size of 15 μm, and the ZnO filler with a particle size of 0.5 μm were stirred and mixed by planetary stirring to form a mixture. The stirring temperature was 130° C. and the stirring time was 160 minutes;

[0052] Step 2: The mixture prepared in step 1 is calendered to form a non-adhesive layer, and the thickness of the non-adhesive l...

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Abstract

The invention relates to a thermal conductive member, which comprises a thermal conductive layer and a non-adhesive layer, wherein the non-adhesive layer is arranged on any surface of the thermal conductive layer. The non-adhesive layer comprises the following components in parts by weight: 20 to 60 parts of phase change material, 300 to 500 parts of metal filling material, and 100 to 200 parts of ceramic filling material, and is prepared through steps of mixing, stirring, forming non-adhesive layer, mixing, stirring, forming thermal conductive layer, and laminating two layers together. The thermal conductive member has the advantages that the thermal conductive member is composed of a thermal conductive layer and a non-adhesive layer, the non-adhesive layer can be arranged on any surface of the thermal conductive layer, thus the influence of the non-adhesive layer on the thermal conductive performance of whole thermal conductive member is very small; moreover, the peeling force and friction force of the non-adhesive layer are both very small, so the non-adhesive layer can be conveniently installed and adjusted during the assembly process, the precision of installation can be guaranteed; due to the existence of the non-adhesive layer, the heating element, heat dissipating element, and thermal conductive member will not be stuck together, and the disassembly becomes more convenient.

Description

technical field [0001] The invention relates to the technical field of heat conduction, in particular to a heat conduction component and a preparation method thereof. Background technique [0002] In recent years, with the rapid development of electronic products, the integration of electronic products has become higher and higher, and the workmanship has become more and more refined, which requires higher performance requirements for the electronic components inside the product. [0003] All electronic components are involved in a heat dissipation problem, because the temperature of electronic components will rise during use, especially transistors and some semiconductor components are particularly prone to heat, when the temperature of electronic components rises, the performance of electronic components will decline, Ultimately, the quality of electronic products deteriorates. [0004] Therefore, in order to ensure the quality of electronic products, the first thing to s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/04B32B15/20B32B37/15H05K7/20
CPCB32B15/04B32B15/20B32B37/156H05K7/2039
Inventor 吴靖
Owner PINGHU ALLIED IND
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