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Piezo-actuated wire bonding setup

A wire bonding, piezoelectric drive technology, applied in circuits, electrical components, electrical solid devices and other directions, can solve the problems of difficult to stabilize and control the bonding force, complex force calibration process, etc., to achieve measurement and real-time feedback, reduce Overall mass and motion inertia, the effect of small size

Active Publication Date: 2018-02-09
TIANJIN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These methods will be affected by the inertial force during the movement process, it is difficult to accurately ensure the stability and controllability of the bonding force, and the force calibration process is more complicated

Method used

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  • Piezo-actuated wire bonding setup
  • Piezo-actuated wire bonding setup
  • Piezo-actuated wire bonding setup

Examples

Experimental program
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Embodiment Construction

[0013] In order to further understand the invention content, characteristics and effects of the present invention, the following examples are given, and detailed descriptions are as follows in conjunction with the accompanying drawings:

[0014] see Figure 1 ~ Figure 3 , a piezoelectric driven wire bonding device, including a base 1 and a swing platform 5 arranged above it; between the swing platform 5 and the base 1, two left and right columns 3 and a bridge-shaped An amplification mechanism 2, the bridge-type amplification mechanism 2 is centrally arranged between the two columns 3; the lower end of the column 3 is fixed on the front part of the upper surface of the base 1, and the upper end of the column 3 is flexibly Hinge IV11 is connected with the front part of the lower surface of the oscillating platform 5; the bridge type amplification mechanism 2 includes two movable connecting rods 2-3 arranged in parallel, and the movable connecting rod 2-3 is connected with the b...

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Abstract

The invention discloses a piezoelectric driving type wire bonding device. The piezoelectric driving type wire bonding device comprises a substrate and a swinging platform arranged above the substrate, wherein a left upright post, a right upright post and a bridge-type amplifying mechanism are arranged between the swinging platform and the substrate; a piezoelectric ceramic driver is arranged in the bridge-type amplifying mechanism; the piezoelectric ceramic driver is provided with a pre-tightening bolt; the pre-tightening bolt is connected to the bridge-type amplifying mechanism; a fixed seat is mounted in the middle of the front part of the upper surface of the swinging platform; the fixed seat is fixedly connected with an energy converter; the energy converter comprises an amplitude-change pole arranged vertical to a swinging shaft of the swinging platform; an ultrasonic piezoelectric vibrator is arranged at the input end of the amplitude-change pole; and the output end of the amplitude-change pole is connected with a chopper vertical to the amplitude-change pole. The device adopts the piezoelectric ceramic driver for driving, and is compact in structure, low in weight and little in movement inertia, so that the operation stability of a bonding head in the packaging process can be improved.

Description

technical field [0001] The invention belongs to the field of semiconductor device processing, in particular to a piezoelectric driven wire bonding device. Background technique [0002] Wire bonding is a process technology that connects the soldering area of ​​the semiconductor chip with the I / O lead of the electronic package housing or the technical wiring soldering area on the substrate with metal filaments. The bonding head is the Z-direction driving part of the wire bonding machine, its structure and control play a crucial role in realizing the arc movement required for the wire bonding process and the control of the bonding force during the bonding process. At the same time, the bonding head mechanism The static and dynamic characteristics of components also restrict the improvement of system performance. [0003] Traditional bonding heads mostly use driving methods such as voice coil motors and linear motors. The selection of these driving methods affects the compactne...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/60
CPCH01L24/85H01L24/78H01L2224/78H01L2224/78301H01L2924/00012
Inventor 梁存满王福军田延岭张大卫
Owner TIANJIN UNIV
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