A kind of processing technology of battery cover protective sleeve
A processing technology and protective cover technology, applied in the field of processing technology of battery cover protective cover, can solve the problems of difficult printing and processing, high product defect rate, easy breakage, etc., and achieve good toughness and strength, stable shape and dimension, and reduce defect rate. Effect
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0037] A processing technology for a battery cover protective cover, which comprises the following steps:
[0038] Step 1, prepare the film: prepare a film with a thickness of 0.175 mm; in this embodiment, the film is a PC film with a frosted surface;
[0039] Step 2, printing the ink layer and drying: printing the ink layer of the desired color on the film, and then baking the ink layer at 80°C for 60 minutes to dry the ink layer;
[0040] Step 3, printing the peelable adhesive layer and drying: printing the peelable adhesive layer on the ink layer, and then baking the peelable adhesive layer at 60°C for 10 minutes to dry the peelable adhesive layer to obtain a film to be formed;
[0041] Step 4, punching positioning holes: punching positioning holes on the film to be formed obtained in step 3;
[0042] Step 5, put the film into the mold: put the film to be formed with the positioning hole punched into the mold, and position it through the positioning hole, and place the pee...
Embodiment 2
[0050] A processing technology for a battery cover protective cover, which comprises the following steps:
[0051] Step 1, prepare the film: prepare a film with a thickness of 0.095 mm; in this embodiment, the film is a PC film with a frosted surface;
[0052] Step 2, printing the ink layer and drying: printing the ink layer of the desired color on the film, and then baking the ink layer at 70°C for 70 minutes to dry the ink layer;
[0053] Step 3, printing the peelable adhesive layer and drying: printing the peelable adhesive layer on the ink layer, and then baking the peelable adhesive layer at 50°C for 15 minutes to dry the peelable adhesive layer to obtain a film to be formed;
[0054] Step 4, punching positioning holes: punching positioning holes on the film to be formed obtained in step 3;
[0055] Step 5, put the film into the mold: put the film to be formed with the positioning hole punched into the mold, and position it through the positioning hole, and place the pee...
Embodiment 3
[0063] A processing technology for a battery cover protective cover, which comprises the following steps:
[0064] Step 1, prepare the film: prepare a film with a thickness of 0.195 mm; in this embodiment, the film is a PC film with a frosted surface;
[0065] Step 2, printing the ink layer and drying: printing the ink layer of the desired color on the film, and then baking the ink layer at 90°C for 50 minutes to dry the ink layer;
[0066] Step 3, printing the peelable adhesive layer and drying: printing the peelable adhesive layer on the ink layer, and then baking the peelable adhesive layer at 70°C for 5 minutes to dry the peelable adhesive layer to obtain a film to be formed;
[0067] Step 4, punching positioning holes: punching positioning holes on the film to be formed obtained in step 3;
[0068] Step 5, put the film into the mold: put the film to be formed with the positioning hole punched into the mold, and position it through the positioning hole, and place the peel...
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com