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Method for producing plated material, and plated material

A manufacturing method and tin plating technology, applied in contact parts, thin material handling, transportation and packaging, etc., can solve the problems of insufficient adhesion between tin plating and silver plating, and achieve excellent wear resistance and electrical conductivity. Effects of low fit, low sliding properties, and excellent wear resistance

Active Publication Date: 2016-02-17
ORIENTAL MEKKI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this method, tin and silver are alloyed by heating, and insufficient adhesion between tin plating and silver plating inevitably becomes a serious problem (that is, it is not a technology to laminate good silver plating on tin plating.

Method used

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  • Method for producing plated material, and plated material
  • Method for producing plated material, and plated material
  • Method for producing plated material, and plated material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0141] A 1 μm silver-plated layer was formed on a commercially available reflow tin-plated material (a copper alloy material having a thickness of 0.6 mm tin-plated and subjected to a reflow treatment (first step)) by the following steps. The surface of the tin-plated layer was rinsed by immersing the tin-plated material in a 50° C. cleaning solution containing 40 g / L of MAXCLEENNG-30 manufactured by KIZAI CO., LTD. for 60 seconds.

[0142] Next, the tin-plated material after the above-mentioned cleaning treatment was immersed in a stripping solution at 25°C containing 300 ml / L and 100 ml / L of Ebastrip ST-40A manufactured by JCU Corporation and ST-401NC, respectively, for 60 seconds, and the stripping treatment ( first process). In addition, a masking tape (insulation tape) was attached to the area where peeling was not required to perform masking.

[0143] Next, using a nickel plating bath containing 300 g / L of nickel sulfamate, 5 g / L of nickel chloride hexahydrate, 10 g / L o...

Embodiment 2

[0152] Except having set the time of the nickel plating process to 20 seconds, and having formed the nickel plating layer of thickness 0.1 micrometer, it carried out similarly to Example 1, the plating material was produced, and various evaluations were performed. Table 1 shows the obtained results.

Embodiment 3

[0154] Except having set the time of the silver plating process to 130 seconds, and having formed the plated layer with thickness 5 micrometers, it carried out similarly to Example 2, produced the plated material, and performed various evaluation. Table 1 shows the obtained results.

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Abstract

Provided are: a plated material which has excellent abrasion resistance, electrical conductivity and sliding performance and low friction, and in which a plating layer does not undergo embrittlement properly; and a method for producing the plated material. The present invention is a method for producing a plated material, said method being characterized by comprising: a first step of removing at least a part of a reflow tin plating layer from a metallic base material, wherein the metallic base material has the reflow tin plating layer on at least a part thereof and a reactive layer is provided at the interface between the reflow tin plating layer and the metallic base material; a second step of subjecting at least a part of a region in which the reflow tin plating layer has been removed to a nickel plating treatment; a third step of subjecting at least a part of a nickel plating layer formed by the nickel plating treatment to a silver strike plating treatment; and a fourth step of subjecting at least a part of a region on which the silver strike plating treatment has been applied to a silver plating treatment.

Description

technical field [0001] The present invention relates to a manufacturing method of a plating material and a plating material obtained by the manufacturing method, more specifically, to a material having excellent wear resistance, electrical conductivity, sliding properties and low friction and suitable for suppressing embrittlement of the plating layer Plating material and its manufacturing method. Background technique [0002] Silver plating has excellent characteristics such as electrical conductivity, low contact resistance, and heat resistance, and is widely used in electrical and electronic parts such as various contacts, terminals, connectors, and switches (for example, refer to Patent Document 1 (Japanese Patent Laid-Open 2001 - Bulletin No. 3194)). [0003] In recent years, electric vehicles, plug-in hybrid vehicles, etc. have become more popular, and charging devices such as home charging devices and quick charging devices have also become more popular. The termina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/12C25D5/50C25D7/00H01R13/03
CPCC25D3/12C25D3/30C25D3/40C25D3/46C25D3/48C25D3/50C25D5/12C25D5/48C25D5/505C25F1/00C25F5/00H01R13/03Y10T428/12896
Inventor 高桥宏祯
Owner ORIENTAL MEKKI
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