Electroplating liquid for pulse electroplating for compact silver film on ceramic surface and electroplating method thereof

Abstract

The invention discloses an electroplating liquid for pulse electroplating for a compact silver film on a ceramic surface and an electroplating method thereof. The electroplating liquid comprises 2-50g / L of silver citrate, 10-120g / L of 2-sulpho-5,5-dimethyl hydantoin, 10-50g / L of succinimide, 10-50g / L of potassium hydroxide, 10-40g / L of potassium citrate, 1-3g / L of ammonium molybdate, 0.5-2g / L of polyethylene glycol, 20-150g / L of sodium sulphite, and 5-20g / L of isonicotinic acid, wherein the pH value of the electroplating liquid is adjusted to 8-10 by virtue of potassium hydroxide, and the temperature of the electroplating liquid is kept at 25-45 DEG C; and the ceramic pre-plated metal layer surface is electroplated by a square-wave pulse current method, and a layer of compact silver film can be electrodeposited. The electroplating liquid is high in stability; and the plating layers obtained by the pulse electroplating method are smooth and compact, uniform in brightness, and high in performance of binding with a ceramic matrix.

Description

technical field [0001] The invention relates to the field of ceramic surface metallization, in particular to a cyanide-free silver plating solution and an electroplating method for pulse electroplating a dense silver film on the ceramic surface. Background technique [0002] With the rapid development of inorganic materials, ceramic materials are more and more widely used in various fields, and the demand for metallization of ceramic surfaces is also increasing. However, due to the non-conductive nature of the ceramic material itself, there are problems such as poor bonding force, difficulty in controlling the surface brightness of the coating, and uneven film thickness in the metallization of the surface. [0003] Cyanide-containing silver plating solution is harmful to the environment and has been gradually replaced by cyanide-free silver plating solution. However, the existing cyanide-free silver plating solution is generally not stable enough. However, the performance of...

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Problems solved by technology

[0004] Purpose of the invention: In view of the poor stability of the cyanide-free silver plating solution in the prior art, the poor bonding force between the gold-plated layer on the ceramic surface and the substrate, the difficulty in controlling the surface brightness of the coating and the uneven film thickness, one of the purposes of the present invention is to provide a A kind of stable cyanide-free silver-plating liquid that is applied to ceramic substrate, the second purpose is to provide a kind of method for electroplating compact silver thin film on ceramic surface, make the silver thin film obtained by electro-depositing have good bonding force, bright surface, dense and even thin-layer silver film

[0005] Technical solution: In order to solve the problem of poor stability of the cyanide-free silver plating solution, the present invention adopts the following technical solutions:

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