Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

PCB structure

A PCB board, the eleventh technology, applied in the direction of printed circuit components, printed circuits, electrical components, etc.

Active Publication Date: 2016-02-03
廖建兴
View PDF7 Cites 42 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present invention provides a PCB board structure, which can solve the problems of signal integrity, power integrity and electromagnetic compatibility caused by PCB board design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB structure
  • PCB structure
  • PCB structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0138] The embodiment of the present invention provides a PCB board structure, which can solve the problems of signal integrity, power supply integrity and electromagnetic compatibility caused by PCB board design.

[0139] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is an embodiment of a part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.

[0140] Each will be described in detail below.

[0141] The terms "first", "second", "third", "fourth", etc. (if any)...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the field of PCB manufacturing, in particular to a PCB structure. The PCB structure comprises at least four signal layers and at least two ground layers, which are laminated with each other, wherein the at least four signal layers are used for transmitting signals; the at least two ground layers are used for being grounded; the top layer and the bottom layer of the PCB structure are signal layers; the ground layers are arranged above zero layers in the adjacent layers of the signal layers; and a power supply plane is arranged in each signal layer and is located in an unrouted region of each signal layer. According to the PCB structure, the functions of a power supply layer are achieved through the power supply planes distributed on the signal layers; and at least one layer in the adjacent layers of the signal layers is the ground layer, so that the condition that reflux paths of the signal layers are not in the reflux path formed between the power supply planes and the ground layers is ensured; the problems of power supply integrity, signal integrity and electromagnetic compatibility are solved; and the development time and the research and development cost are greatly reduced.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a PCB board structure. Background technique [0002] PCB board (Printed Circuit Board, printed circuit board) is the support body of electronic components and the carrier of electrical connection of electronic components. It is widely used in industrial control motherboards and medical motherboards based on X86 (a complex instruction set) platform, ATCA ( Advanced Telecom Computing Architecture, advanced communication computer architecture) blade server motherboard, industrial control motherboard based on PowerPC (PerformanceOptimizationWithEnhancedRISC-PerformanceComputing, simplified instruction set architecture) platform based on DSP (Digital Signal Processing, digital signal processor), ultra-large-scale FPGA (Field-ProgrammableGateArray, on-site programming gate array), wireless base station mainboard of PowerPC platform, telecom mainboard based on DSP, ultra-large-scale FPG...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/02
CPCH05K1/0224
Inventor 唐水
Owner 廖建兴
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com