Chip heat radiation assembly and chip circuit board thereof

Abstract

The invention discloses a chip heat radiation assembly and a chip circuit board thereof. The heat radiation assembly comprises a base (1), heat radiation fins (2), springs (3), adjusting rod assemblies (4) and locking screws (5). The upper surface (104) of the base (1) is provided with circular holes (102) and special-shaped through holes (101), wherein the depths of the circular holes (102) are smaller than the thickness of the base (1). The lower surface (105) of the base is provided with a base boss (103) for installing a chip. Each adjusting rod assembly (4) comprises a support bar (401) and an adjusting nut (403), the support bar (401) is composed of a polished rod (406) and a threaded rod (402), the adjusting nut (403) is internally provided with a threaded through hole (405), and the threaded rod (402) is provided with external threads screwed with an inner threaded hole (404). The height of each adjusting nut (403) is smaller than the sum of heights of the chip and the base boss (103), and the locking screws (5) are screwed into the threaded through holes (405). The invention can improve the heat radiation effect and the assembly reliability.

Description

technical field [0001] The invention relates to the technical field of communication, and relates to a heat dissipation component and a circuit board using the heat dissipation component, in particular to a chip heat dissipation component and a chip circuit board thereof. Background technique [0002] With the continuous development of the electronic information industry, the operating frequency and speed of the chip are constantly increasing, and the heat generated by it is increasing, which makes its temperature rise continuously, which seriously threatens the performance of the chip when it is running. In order to ensure the normal operation of the chip, it must be timely Dissipate the large amount of heat generated by the chip. At present, the usual method is to add a heat sink on the chip, and then use a thermal interface material with bonding function (such as pressure-sensitive double-sided adhesive, two-component thermally conductive adhesive) to fix the heat sink on...

AI Technical Summary

Problems solved by technology

At present, the usual method is to add a heat sink on the chip, and then use a thermal interface material with bonding function (such as pressure-sensitive double-sided adhesive, two-component thermally conductive adhesive) to fix the heat sink on the chip, but the above-mentioned adhesive The bonding force of the thermal interface material with bonding function can only reach the effective value after bonding for a period of time, and in the bonding process, due to the weight of the heat sink itself, it will cause a problem in the transportation or production process due to the bonding force If the effective value is not reached, the heat sink will fall off, resulting in a decrease in production efficiency. At the same time, the thermal interface material will fail quickly after long-term operation in a high-temperature environment, causing the heat sink to not be firmly adhered to the chip, making the heat sink unable to achieve good performance. The heat dissipation effect even still has the problem of falling off

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