Light source assembly and backlight module

Abstract

The invention discloses a light source assembly. The light source assembly comprises a circuit board, a reflection assembly and multiple emitting diode chips. The reflection assembly comprises a reflection sheet and a reflection support. The reflection sheet is stacked between the circuit board and the reflection support. The circuit board is attached to the reflection support. The reflection support comprises a first surface, a second surface and multiple reflection ring surfaces. The first surface is opposite to the second surface. One ends of the multiple reflection ring surfaces are communicated with the first surface and multiple first openings are formed. The other ends of the multiple reflection ring surfaces are communicated with the second surface and multiple second openings are formed. The area of the first opening is smaller than that of the second opening. The multiple emitting diode chips are attached to the reflection sheet and accommodated into the multiple first openings in a one-to-one correspondence mode. The light source assembly adopts LEDs and has uniform illumination brightness. The invention further discloses a backlight module.

Description

technical field [0001] The invention relates to the technical field of light-emitting diode displays, in particular to a light source assembly using light-emitting diodes and a backlight module using the light source assembly. Background technique [0002] CSP (ChipScalePackage), translated into Chinese means chip size packaging, or chip-level packaging, is the latest generation of memory chip packaging technology, and its technicality is mainly reflected in the ratio of chip area to package area exceeding 1:1.14, which is in line with the ideal The 1:1 of the situation is pretty close. Compared with the LED industry, CSP packaging exists based on flip-chip technology. CSP devices refer to controlling the packaging volume and flip-chip volume to be the same or the packaging volume is not greater than 20% of the flip-chip volume. Because CSP packaging technology can effectively reduce the packaging volume, small, thin and light, it caters to the current trend of miniaturizat...

AI Technical Summary

Problems solved by technology

However, when the CSP-packaged LED light source is applied to a side-in liquid crystal display, due to its high luminous power and large spacing between LEDs, it is easy to cause light leakage and uneven brightness (hotspot)

Although light-absorbing materials can be used to improve the above problems, for side-entry liquid crystal displays, using light-absorbing materials will reduce the utilization of light energy, and it is difficult to improve the hotspot phenomenon when the distance between LED lights is increased.

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