A device for automatically flipping and inserting panels

A technology of automatic flipping and board parts, which is applied in the direction of electrical components, printed components, electrical connection formation, printed circuit manufacturing, etc. problems, to achieve the effect of reducing the contact defect rate of the board, efficient and stable output, and improving the yield of the board

Active Publication Date: 2017-12-08
XUNDE MACHINERY DONGGUAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method is inefficient, and because the surface of the board is not dry after the silver paste is poured, it can only touch the invalid area of ​​the edge of the board about a few millimeters wide, and the personnel are easy to touch the printing area when receiving the material and pollute the board
Therefore, general manufacturers are often troubled by yield and production capacity.

Method used

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  • A device for automatically flipping and inserting panels
  • A device for automatically flipping and inserting panels
  • A device for automatically flipping and inserting panels

Examples

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Embodiment Construction

[0030] The present invention will be further detailed below in conjunction with the drawings:

[0031] Such as Figure 1 to Figure 7 As shown, an embodiment of a device for automatically turning over a frame for a panel according to the present invention includes a bracket 1 and a conveying and turning mechanism 2 installed in the bracket 1 and a frame lifting and lowering mechanism that cooperates with the conveying and turning mechanism 2 The mechanism 3 and the frame access mechanism 4 matched with the frame lifting mechanism 3,

[0032] The conveying and turning mechanism 2 clamps the plate that enters the designated position of the conveying and turning mechanism 2. After the conveying and turning mechanism 2 is turned, the plate is inserted into the empty frame on the frame lifting mechanism 3; for a certain batch Before the production of the secondary plate, the operator sets the plate size parameters through the man-machine interface, and the plate is transported into the ...

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PUM

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Abstract

A board automatic overturning and plugging frame device provided by the present invention comprises a support, a conveying and overturning mechanism arranged in the support, a frame elevating mechanism matching the conveying and overturning mechanism and a frame in and out mechanism matching the frame elevating mechanism. The conveying and overturning mechanism tightly clamps a board entering an appointed position of the conveying and overturning mechanism, and plugs the board in an empty frame on the frame elevating mechanism after overturning. After the board is plugged in the blank space of the empty frame, the frame elevating mechanism moves the empty frame to the next blank space to wait for the plugging of the next board until the empty frame is filled. The frame in and out mechanism comprises an empty frame input mechanism and a full frame output mechanism connected with the empty frame input mechanism. The beneficial effects of the board automatic overturning and plugging frame device provided by the present invention are that: the board bad contact rate caused by the workers is reduced greatly, and the efficient and stable output is provided.

Description

Technical field [0001] The invention relates to a device for automatically turning a board into a frame. Background technique [0002] At present, in the production process of interconnection of double-sided and multi-layer printed circuit boards in China, most manufacturers use lead wires, rivets or electroless plating (electroless copper method, blackening method) to plate conductor materials into holes Wall, then direct plating method and so on. This type of method has advantages and disadvantages, and is also more effective, but it has high manufacturing costs and brings environmental problems. The production of through-hole technology has formed an effective interconnection and made up for the defects of traditional methods. It infiltrates conductive printing materials such as silver paste, carbon paste or copper paste into the prefabricated holes through screen leakage, so that the hole is filled with conductive printing materials with injection or rivet structure, and so...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/40
CPCH05K3/40H05K2203/1563
Inventor 黄发保颜朝信
Owner XUNDE MACHINERY DONGGUAN CO LTD
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