QFN packaged phase-locked chip test device

Abstract

The invention discloses a QFN packaged phase-locked chip test device, which comprises a test fixture (1). A test adapter circuit board (3) is fixed onto a bottom plate (4). The conductive rubber (2) is arranged to cover a bonding pad of a phase demodulation chip of the test adapter circuit board (3). The pressing device of the test fixture (1) presses a to-be-tested chip onto the conductive rubber (2). The device solves the problems during the testing process of QFN packaged phase-locked chips in the prior art, including the inaccurate test results of devices under the influence of the parasitic parameters of test probes, the abrasion of bonding pads, the damage to chips, the imperfect test results of chips, the badly influenced working reliability of QFN packaged phase-locked chips and the like due to the fact that chips are directly and hardly pressed onto bonding pads.

Description

technical field [0001] The invention belongs to the technical field of testing electronic components, in particular to a testing device for a QFN packaged phase-locked chip. Background technique [0002] The testing of microwave devices has always been a difficult point in the component testing industry, especially for the testing of phase-locked chips in QFN packages, which is even more difficult. Traditional test fixtures use metal probes to contact chip pins with adapter pads for device testing. When this method has a high frequency, the test result of the device will be affected by the parasitic parameters generated by the test probe, and even the device cannot work normally. In addition, now the QFN package phase-locked loop chip integrates the R frequency divider, N frequency divider, lock indication and other circuits with the frequency and phase detector into one chip. For the test of this powerful phase-locked loop chip, currently There is no suitable test method ...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention: provide a kind of QFN package phase-locked chip testing device, to solve the parasitic parameter produced by the test probe that exists in QFN package phase-locked chip test in the prior art, influence the test result of the device, the direct hard pressing of the chip Testing on pads will cause problems such as pad wear, chip damage, and incomplete chip function testing, which will seriously affect the reliability of the QFN packaged phase-locked chip.

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