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Substrate-free LED filament and manufacturing method thereof, and substrate-free LED filament lamp

A technology of LED filament and manufacturing method, which is applied in the field of substrate-less LED filament lamps, can solve the problems of high cost and complex manufacturing process of LED filament, and achieve the effects of low cost, simple manufacturing process and small thermal resistance

Active Publication Date: 2015-12-09
ZHEJIANG LEDISON OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The manufacturing process of the LED filament in the prior art is relatively complicated and the cost is high, which is one of the main components of the cost of the current LED filament lamp.

Method used

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  • Substrate-free LED filament and manufacturing method thereof, and substrate-free LED filament lamp
  • Substrate-free LED filament and manufacturing method thereof, and substrate-free LED filament lamp
  • Substrate-free LED filament and manufacturing method thereof, and substrate-free LED filament lamp

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Embodiment Construction

[0064] The present invention will be further described below in conjunction with the drawings and embodiments.

[0065] Figure 1A with Figure 1B It is a kind of substrate-less LED filament of the present invention---a schematic cross-sectional structure diagram of an embodiment of the initial substrate-less LED filament 1, wherein Figure 1A Is a schematic diagram of the radial section of the filament, Figure 1B A schematic diagram of a partial axial section of one end of the filament. In the figure, 2 is the LED chip, 3 is the electrical connection line between the chip 2 and between the chip and the electrical lead 4; 5 is the first luminescent powder on the welding end of the electrical connection line of the LED chip 2 and the electrical lead 4 Floor.

[0066] The initial substrate-less LED filament 1 can be used to manufacture LED filament lamps; if the LED chip used is a transparent chip that emits blue light, blue light will be emitted directly; if the LED chip used is an o...

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PUM

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Abstract

The invention provides a substrate-free LED filament and a manufacturing method thereof, and a substrate-free LED filament lamp. The filament comprises at least a string of LED chips with same or different illuminant colors, electric lead-out wires, and electric connecting wires arranged between the chips and between the chips and the electric lead-out wires, welding terminals of the chips, the electric connecting wires, and the electric lead-out wires are coated by first luminescent powder layers to form an initial substrate-free LED filament, the other side of the initial substrate-free LED filament is coated by a second luminescent powder layer to form the substrate-free LED filament, and the substrate-free LED filament can be adhered on the external surface of a transparent high-heat-conductivity tube via transparent adhesive tapes or luminescent powder glue to form a cylindrical substrate-free LED filament light source used for manufacturing a high-power LED filament lamp. The substrate-free LED filament lamp comprises at least a bulb shell sealed in a vacuum manner and inflated with heat radiation protection gas, at least one substrate-free LED filament light source is arranged in each bulb shell, and the substrate-free LED filament light source comprises the initial substrate-free LED filament, the substrate-free LED filament or the cylindrical substrate-free LED filament light source; an LED drive, a drive shell, and an electric connector etc. and used for illumination.

Description

Technical field [0001] The invention relates to an LED filament lamp, in particular to a substrate-less LED filament and a manufacturing method thereof, and a substrate-less LED filament lamp manufactured by using the same for lighting. Background technique [0002] The filament of the LED filament lamp in the prior art is fixed on a substrate with at least one string of LED chips with die-bonding glue. There are electrical connection lines between the chips, and at least one layer of luminescent powder is around the chip and the substrate. There is an electrical lead wire electrically connected to the chip at the end. [0003] The LED chip is a chip that emits blue or ultraviolet light; the luminescent powder layer is made of a mixture of luminescent powder and a transparent medium; the luminescent powder matches the light emitted by the LED chip to obtain white light or other desired colors Light. [0004] The substrate of the LED filament is a transparent or opaque substrate, su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/26H01L33/52H01L33/00F21S2/00F21V19/00F21V23/00F21V23/06F21Y101/02
CPCH01L33/005H01L33/26H01L33/52H01L33/62F21V19/001F21V23/003F21V23/06H01L2933/0008H01L2933/0033H01L2933/005H01L2933/0066H01L2224/8592H01L2924/181H01L2924/1815H01L2224/48091H01L2224/48137H01L2924/00014H01L2924/00012
Inventor 葛世潮葛晓勤
Owner ZHEJIANG LEDISON OPTOELECTRONICS
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