A wire cutting saw with variable arc length for processing hard and brittle materials

Abstract

The invention provides an arc-length-variable wire cutting saw for machining crisp and hard materials in the technical field of mechanical manufacturing and applied to extreme machining. The arc-length-variable wire cutting saw comprises a wire guide wheel drive mechanism, a wire cylinder and wire conveying mechanism, a wire tension adjusting and controlling mechanism, a driving and cutting mechanism, a stand column and beam and a workbench. The workbench is installed on a lower beam body of the stand column and beam. The wire cylinder and wire conveying mechanism is arranged on an upper beam body of the stand column and beam. The wire tension adjusting and controlling mechanism and the driving and cutting mechanism are arranged on a stand column of the stand column and beam. The wire guide wheel drive mechanism is fixed to the upper end of the stand column of the stand column and beam. A second lead screw is driven by a synchronous belt to rotate so as to drive a fist sliding base matched with the second lead screw to move up and down along a second guide rail. A first wire guide wheel and an adjusting wheel are fixed to the first sliding base through bearings. By means of the arc-length-variable wire cutting saw, the sawing wire can be much fine, and the saw seam width is lowered; the using rate is increased, and the span of cutting wheels of the wire saw is adjustable; and the wire cutting saw is small in saw shearing force, few in cuttings, low in noise, smooth and orderly in cut face, simple in structure and low in cost.

Description

Technical field [0001] The invention relates to a wire cutting saw for processing hard and brittle materials with variable arc length in the technical field of micro-machine manufacturing with the limit of micro-processing. Background technique [0002] At present, more than 90% of the world’s integrated circuits use silicon wafers as the substrate. With the special environment of aerospace, oil drilling and other industrial technologies for new requirements on integrated circuits, superhard materials such as silicon carbide crystals are greatly affected in this field. Pay attention to and get great development. In the 21st century, it has been shown that non-metallic materials represented by ceramic materials and carbon fiber composite materials have become one of the three important pillars of modern engineering structures, just like metal materials and composite materials. [0003] These materials mainly include various stone, gemstones, glass, silicon crystals, quartz crystals...

AI Technical Summary

Problems solved by technology

These cutting methods have their own advantages and limitations. For example, diamond saw blade cutting generally cannot cut curves, and the slit is wide, and the yield rate is low. It is not suitable for precision cutting of precious materials.

Laser beam cutting has a wide range of applications, but the cutting depth is limited. If a high-power laser is used, the high-temperature plasma generated between the laser and the workpiece will significantly reduce the processing efficiency, increase the difficulty of discharging the melt, and the equipment investment is expensive

High-pressure water jet cutting can cut brittle non-metallic materials such as stone and ceramics, but the slit is wide, it is difficult to achieve fine cutting processing, and the equipment is expensive, and it takes a lot of people and water resources to cut

Images