A Multi-level Wavelength Division Multiplexing Ring Optical Network

Abstract

The present invention proposes a multi-level wavelength division multiplexing ring optical network, including a data transmission plane and a unified control node of the whole network, and the data transmission plane includes p parallel first-level rings connected through cross-ring frame top / cluster switches and m secondary rings, and a top-of-rack / cluster switch connected to the secondary rings. The present invention uses wavelength division multiplexing technology, has high-speed and large-capacity characteristics and good scalability, uses wavelength information to exchange data across racks in the data center, and partially overcomes the shortcomings of the traditional tree network in the data center. Under this structure, only the C-band is applicable to the wavelength division multiplexing ring network. After calculation, a switching network with 256,000 servers can be realized, which can provide technical reference for the design of large-scale data center switching network. At the same time, the network structure of the present invention can be used for switching between CPU clusters of high-performance computers, and can also be used for end-to-end switching optical networks oriented to telecommunication services.

Description

technical field [0001] The invention belongs to the field of optical fiber communication and relates to a multi-level wavelength division multiplexing ring optical network. Background technique [0002] In the data center, data exchange between servers needs to occupy a large bandwidth. Building a data center switching network with high speed, large capacity, strong scalability, flexible configuration, and energy saving and high efficiency is a very important link in building a large-scale data center. Traditional There are many disadvantages in the tree-shaped switching network. For example, because the closer to the root node, the heavier the load, the performance of the root node is extremely high, and the performance of the root node limits the size of the data center; the failure of the upper-level switching node will cause It cannot work normally; as the scale of the data center increases, the power consumption of the tree-shaped switching network will increase sharply...

AI Technical Summary

Problems solved by technology

[0002] In the data center, data exchange between servers needs to occupy a large bandwidth. Building a data center switching network with high speed, large capacity, strong scalability, flexible configuration, and energy saving and high efficiency is a very important link in building a large-scale data center. Traditional There are many disadvantages in the tree-shaped switching network. For example, because the closer to the root node, the heavier the load, the performance of the root node is extremely high, and the performance of the root node limits the size of the data center; the failure of the upper-level switching node will cause Unable to work normally; with the increase of the data center scale, the power consumption of the tree-shaped switching network will increase sharply, etc.

[0003] In recent years, the use of optical network technology to solve the problems of using traditional tree structures in data centers has become a research hotspot in the direction of optical networks, such as the Helios structure proposed by N.Farrington et al., the Hi-LION structure proposed by S.Yoo et al., etc. However, the above structure has problems such as large switching delay of the optical switch, or high manufacturing cost of the device.

[0004] In high-performance computers, the use of optical interconnection can greatly increase the communication bandwidth between CPUs, reduce the data transmission delay between CPUs, and build optical interconnections in high-performance computers with high bandwidth, low latency, good scalability, and controllable networking costs. The network is a key technology to improve the performance of high-performance computers. Similarly, the Hi-LION structure proposed by S.Yoo et al. has the problem of high device manufacturing costs.

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