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3D integrated superminiature band pass filter

A bandpass filter and three-dimensional integration technology, applied in the direction of waveguide devices, circuits, electrical components, etc., can solve the problems that cannot meet the requirements of miniaturization, occupy a large volume in the low frequency band, and insufficient stopband attenuation, etc., and achieve insertion loss The effect of small size, high reliability and low cost

Inactive Publication Date: 2015-10-07
NANJING UNIV OF SCI & TECH
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AI Technical Summary

Problems solved by technology

[0004] At present, a lot of research has been done on bandpass filters at home and abroad. The low-frequency band occupies too much volume and the integration level is not high, which is far from meeting the requirements of miniaturization.
In addition, most of the current filters, if they want to suppress the clutter frequency near the passband, the attenuation in the stopband is insufficient

Method used

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Embodiment Construction

[0010] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0011] Such as figure 1 As shown, the present invention is a three-dimensional integrated ultra-small bandpass filter, which is realized by a multi-layer structure and has the function of bandpass filtering.

[0012] combine figure 1 , a three-dimensional integrated ultra-small built-in absorbing resistance power divider of the present invention, including an input port P1, an output port P2, an input inductance Lin, an output inductance Lout, a first spiral inductance L1, a second spiral inductance L2, a third spiral The inductor L3, the fourth spiral inductor L4, the first capacitor C1, the second capacitor C2, the third capacitor C3, the fourth capacitor C4, an interstage coupling capacitor W, a zigzag cross coupling capacitor Z and the ground plane GND. The input port P1 is connected to the input inductor Lin, the output port P2 is connected to the outp...

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Abstract

The invention provides a 3D integrated superminiature band-pass filter which is realized by adopting a semi-lumped structure, and comprises an input / output port, four parallel-connection resonant cells, an inter-stage coupling capacitor and a Z-shaped crossed coupling capacitor. According to the band-pass filter provided by the invention, interconnection between stages is realized by virtue of electromagnetic coupling among the resonant cells. By virtue of an LTCC (low temperature co-fired ceramic) laminating structure, an equivalent lumped parameter element is realized. Compared with the prior art, the 3D integrated subminiature band-pass filter has the advantages of a small size, low cost, good frequency-selection characteristic, high temperature stability and small insertion loss, can be machined into a paster film, is convenient to integrate with other microwave assemblies and beneficial to mass production. The scheme adopted by the invention can be used for inhibiting out-of-band harmonic waves, and is applicable to occasions and corresponding systems with strict requirements on size, electrical performance, temperature stability and reliability, such as communication terminals of corresponding microwave millimeter wave frequency bands, digital radars and wireless communication hand-held terminals.

Description

technical field [0001] The invention relates to a power splitter, in particular to a three-dimensional integrated ultra-small band-pass filter. Background technique [0002] Nowadays, whether it is military radar, electronic detection, electronic countermeasures, etc., or civilian mobile phone communication, TV, and remote control, it is necessary to distribute and process electronic signals, which requires the use of an important microwave passive device-filter. With the rapid development of miniaturization of mobile communication, satellite communication and national defense electronic systems, high performance, low cost and miniaturization have become the development direction of the microwave / radio frequency field, and the performance, size, reliability and cost of filters are all affected. put forward higher requirements. In some state-of-the-art national defense equipment, the frequency bands used are quite crowded now, so cutting-edge equipment such as satell...

Claims

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Application Information

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IPC IPC(8): H01P1/203
Inventor 周围李永帅戴永胜刘毅
Owner NANJING UNIV OF SCI & TECH
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