Packaging material, organic light-emitting diode device, and packaging method for organic light-emitting diode device
A technology of light-emitting diodes and packaging materials, which is applied in the manufacture of semiconductor devices, electrical solid devices, and semiconductor/solid-state devices. It can solve problems that affect the appearance of transparent display devices, and achieve the effects of isolating damage, small impact, and good sealing performance
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Embodiment 1
[0079] The composition of the packaging material main component of the present embodiment is:
[0080] Ytterbium trioxide (rare earth metal oxide): 40wt%;
[0081] Zinc oxide: 20wt%;
[0082] Aluminum oxide: 20wt%;
[0083] Silica: 20 wt%.
[0084] The laser wavelength used for packaging is: 975nm.
[0085] The performance of the package structure formed by the package material is:
[0086] Color: colorless and transparent;
[0087] Expansion coefficient: -85×10 -7 / °C
[0088] Oxygen barrier capacity: 0.8×10 -3 cm 3 / Meter 2 / sky;
[0089] Water blocking ability: 0.75×10 -6 g / m 2 / sky.
Embodiment 2
[0091] The composition of the packaging material main component of the present embodiment is:
[0092] Cerium oxide (rare earth metal oxide): 80wt%;
[0093] Zinc oxide: 1wt%;
[0094] Aluminum oxide: 14wt%;
[0095] Silica: 5 wt%.
[0096] The performance of the packaging structure formed by the packaging material is:
[0097] The laser wavelength used for packaging is: 244nm.
[0098] The performance of the package structure formed by the package material is:
[0099] Color: colorless and transparent;
[0100] Expansion coefficient: -75×10 -7 / °C
[0101] Oxygen barrier capacity: 0.77×10 -3 cm 3 / Meter 2 / sky;
[0102] Water blocking ability: 0.7×10 -6 g / m 2 / sky.
Embodiment 3
[0104] The composition of the packaging material main component of the present embodiment is:
[0105] Europium trioxide and terbium trioxide (rare earth metal oxide): 75wt%, wherein the mass ratio of europium trioxide and terbium trioxide is 1:1;
[0106] Zinc oxide: 13wt%;
[0107] Aluminum oxide: 2wt%;
[0108] Silica: 10 wt%.
[0109] The laser wavelength used for packaging is: 364nm.
[0110] The performance of the package structure formed by the package material is:
[0111] Color: colorless and transparent;
[0112] Expansion coefficient: -91×10 -7 / °C
[0113] Oxygen barrier capacity: 0.88×10 -3 cm 3 / Meter 2 / sky;
[0114] Water blocking ability: 0.9×10 -6 g / m 2 / sky.
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