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Copper alloy for electronic or electrical device, copper alloy thin sheet for electronic or electrical device, process for manufacturing copper alloy for electronic or electrical device, conductive component for electronic or electrical device, and terminal

A technology for electronic and electrical and conductive components, which is applied in the fields of copper alloys for electronic and electrical equipment, copper alloy sheets for electronic and electrical equipment, manufacture of copper alloys for electronic and electrical equipment, conductive elements and terminals for electronic and electrical equipment, and can solve the problem of stress resistance. The relaxation characteristics are not reliable and sufficiently excellent, etc.

Inactive Publication Date: 2015-09-16
MITSUBISHI MATERIALS CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0018] As mentioned above, Cu-Zn-Sn based alloys conventionally used as base materials for Sn-plated brass strips are used as thin plates that are bent and kept in contact with conductive members on the opposite side in the vicinity of the bent portion. In the case of materials (strips), the stress relaxation resistance characteristics are not yet reliable and sufficiently excellent, so it is strongly desired to further reliably and sufficiently improve the stress relaxation resistance characteristics

Method used

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  • Copper alloy for electronic or electrical device, copper alloy thin sheet for electronic or electrical device, process for manufacturing copper alloy for electronic or electrical device, conductive component for electronic or electrical device, and terminal
  • Copper alloy for electronic or electrical device, copper alloy thin sheet for electronic or electrical device, process for manufacturing copper alloy for electronic or electrical device, conductive component for electronic or electrical device, and terminal
  • Copper alloy for electronic or electrical device, copper alloy thin sheet for electronic or electrical device, process for manufacturing copper alloy for electronic or electrical device, conductive component for electronic or electrical device, and terminal

Examples

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Embodiment

[0135] First, as the melting / casting step S01, a raw material composed of a Cu-40% Zn master alloy and oxygen-free copper (ASTM B152 C10100) having a purity of 99.99% by mass or higher is prepared, the raw material is placed in a high-purity graphite crucible, and the N 2 Melting was performed in an electric furnace under a gas atmosphere. Various additive elements were added to the copper alloy melt, and the alloys with the composition shown in No. 1 to No. 58 in Table 1 to Table 3 as examples of the present invention and No. 101 in Table 4 as comparative examples were smelted. The molten alloy with the composition shown in ~105 was poured into a carbon mold to produce an ingot. In addition, the size of the ingot was about 40 mm in thickness x about 50 mm in width x about 200 mm in length.

[0136] Next, as a homogenization treatment (heating step S02 ), each ingot was held at 800° C. for a predetermined time in an Ar gas atmosphere, and then water quenched.

[0137] Next,...

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Abstract

A copper ally for an electronic or electrical device, containing more than 2.0 to 36.5 mass% of Zn, 0.1 to 0.9 mass% of Sn, 0.05 to less than 1.0 mass% of Ni, 0.5 to less than 10 mass ppm of Fe, 0.001 to less than 0.10 mass% of Co, and 0.001 to 0.10 mass% of P with the balance consisting of Cu and unavoidable impurities, satisfying the relationships among the contents of these elements in atomic ratio, 0.002 ≤ Fe / Ni < 1.5, 3 < (Ni+Fe) / P < 15 and 0.3 < Sn / (Ni+Fe) < 5, and containing a precipitate that contains both P and at least one element selected from the group consisting of Fe, Co and Ni.

Description

technical field [0001] The present invention relates to a copper alloy used as a conductive element for electrical and electronic equipment such as a connector or other terminals of a semiconductor device, or a movable conductive sheet of an electromagnetic relay, or a lead frame, especially in brass (Cu-Zn alloy) Cu-Zn-Sn based copper alloy for electrical and electronic equipment with Sn added, copper alloy sheet for electrical and electronic equipment using the copper alloy for electrical and electronic equipment, method for producing copper alloy for electrical and electronic equipment, electrical conductor for electrical and electronic equipment components and terminals. [0002] This application claims priority based on Patent Application No. 2013-002112 for which it applied in Japan on January 9, 2013, and uses the content for this specification. Background technique [0003] Copper or copper alloys are used as raw materials for conductive elements such as terminals s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/04C22F1/08C25D7/00H01B1/02H01B5/02H01B13/00C22F1/00
CPCC25D5/505H01B1/026C22C9/04C22F1/08H01L2224/45147H01L2924/0103H01L2924/0105H01L2924/01028H01L2924/01027H01L2924/01015H01B13/0016
Inventor 牧一诚森广行山下大树
Owner MITSUBISHI MATERIALS CORP
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