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Photosensitivity siloxane and hyperbranched polyether polyol-containing photosensitive resin composition used for used for three-dimensional rapid moulding

A technology of hyperbranched polyether and photosensitive resin, which is applied in the field of photosensitive resin, composition and its cured products, can solve the problems of limited improvement of curing speed and mechanical properties of photo-cured three-dimensional rapid prototyping materials, and achieve spherical symmetry Good resistance, good curing performance, and regular structure

Active Publication Date: 2015-09-16
HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the improvement of these substances on the curing speed and mechanical properties of light-cured 3D rapid prototyping materials is still limited.

Method used

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  • Photosensitivity siloxane and hyperbranched polyether polyol-containing photosensitive resin composition used for used for three-dimensional rapid moulding
  • Photosensitivity siloxane and hyperbranched polyether polyol-containing photosensitive resin composition used for used for three-dimensional rapid moulding
  • Photosensitivity siloxane and hyperbranched polyether polyol-containing photosensitive resin composition used for used for three-dimensional rapid moulding

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Experimental program
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Embodiment Construction

[0057] The present invention will be further described below in conjunction with embodiment.

[0058] (1) Preparation of photosensitive siloxane:

[0059] Under nitrogen protection, 36.4 grams (280 mL) of hydroxyethyl methacrylate and 40 grams of anhydrous triethylamine were dissolved in 500 mL of toluene and stirred, the temperature was lowered to below zero, and 35.42 grams (140 mmL) of diphenyldichlorosilane was dropped Add to the above solution. After the dropwise addition, the temperature was raised, and the mixture was stirred and refluxed for 24 hours. After the reaction was completed, the solution was filtered and the solvent was evaporated to obtain bis[2-(methacryloyloxy)ethoxy]diphenylsilane as an oil. The H NMR spectrum of the compound is figure 1 shown.

[0060] (2) Preparation of hyperbranched polyether polyol (number average molecular weight 1000g / mol):

[0061] Under nitrogen protection, 1.28 g (9.6 mmol) of trimethylolpropane was dissolved in 200 mL of dr...

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Abstract

The invention relates to the three dimensional rapid moulding photosensitive resin field, and discloses a photosensitivity siloxane and hyperbranched polyether polyol-containing photosensitive resin composition. The composition is suitable for a light-cured three dimensional rapid moulding technology, and comprises A)a low-viscosity photosensitivity group (methyl) acrylate group-containig siloxane with usage amount being 0.1-30wt%; B) hyperbranched polyether polyol with number-average molecular weight being 400-20000g / mol and usage amount being 0.1-50wt%; C)an epoxide group-containing cation light-cured compound with usage amount being 5-70 wt%; D)an unsaturated bond function group-containing free radical light-cured compound usage amount being 2-30 wt%; E)a cation photoinitiator usage amount being 1-10 wt%; F)a free radical photoinitiator usage amount being 1-10 wt%; G)a filling material usage amount being 1-20wt%; H)other auxiliary materials usage amount being 0.1-5wt%. The photosensitive resin composition has good mechanics, calorifics performance and solidification performance of a solidification object after laser three dimensional rapid moulding.

Description

technical field [0001] The invention relates to the field of photosensitive resins for three-dimensional rapid prototyping, in particular to a composition of photocurable resins containing photosensitive siloxane and hyperbranched polyether polyols that can be used in three-dimensional rapid prototyping technology and the field of molded products obtained by curing thereof . Background technique [0002] Stereolithography (SLA) in 3D rapid prototyping technology uses ultraviolet laser beams under computer control to scan point by point on the path of each layered section of the computer model, so that the thin layer of photosensitive resin in the scanned area generates light. Curing after polymerization or photocrosslinking reaction. When one layer is cured, move the worktable in the vertical direction so that the surface of the previously cured resin is covered with a new layer of liquid resin, and then scan and cure layer by layer to finally obtain a 3D prototype. Among t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/075G03F7/004
Inventor 来墨凡
Owner HANGZHOU LEYI NEW MATERIAL TECH CO LTD
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