Packaging structure and method of integrated sensor

A technology for integrating sensors and packaging structures, which is applied in the coupling of electric solid-state devices, semiconductor devices, and optical waveguides, and can solve problems such as product performance degradation, sensor chip stress, and sensor chip electromagnetic interference, so as to improve performance and integrate sensors. The effect of strengthening and improving reliability

Inactive Publication Date: 2015-09-09
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the existing packaging method of integrated sensors, plastic injection will cause serious stress to the more sensitive sensor chips, and there will be electromagnetic interference between different sensor chips, which will affect the normal operation of sensitive sensor chips and integrated sensors, reducing the product performance

Method used

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  • Packaging structure and method of integrated sensor
  • Packaging structure and method of integrated sensor
  • Packaging structure and method of integrated sensor

Examples

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Embodiment Construction

[0028] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0029] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0030] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0031] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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PUM

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Abstract

The invention discloses a packaging structure and method of an integrated sensor. The packaging structure comprises a first substrate, multiple sensors, at least one first packaging cavity and a plastic injection molding packaging structure, the sensors are arranged on the first substrate, each sensor comprises an MEMS sensor chip and an ASIC chip electrically connected with the MEMS sensor chip, a casing and the first substrate are enclosed to form the first packaging cavity, each of the internal and the external of the first packaging cavity is provided with at least one sensor, and the plastic injection molding packaging structure packages all the sensors and all the first packaging cavities. The casing packages and protects a relatively sensitive sensor at first, and then all the sensors are packaged on the first substrate via injection molding plastics in an integrated manner; the problems that injection molding plastics have a stress effect on the sensitive sensor and other sensors interfere the sensitive sensor are solved; and the working performance of the integrated sensor is improved.

Description

technical field [0001] The invention relates to a packaging structure of an integrated sensor and a packaging method of the integrated sensor. Background technique [0002] An integrated sensor is a sensor chip that integrates multiple sensor units (such as an integrated sensor integrated with a pressure sensor unit and a temperature sensor unit), and is used as an independent chip that can simultaneously realize multiple sensing functions. At present, some integrated sensors with multiple sensor units are packaged by attaching each sensor to the substrate through SMT welding, and then integrally packaged with injection molding glue to form an integrated sensor for the final application product, such as figure 1 As shown: the integrated sensor includes two sensor units, one of which includes a MEMS sensor chip 3 and an ASIC chip 5, which are electrically connected through a lead 4, and the AISC chip 5 is connected to the substrate 1 through a lead; the other sensor unit incl...

Claims

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Application Information

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IPC IPC(8): H01L23/10H01L23/552B81B7/02
CPCH01L2924/16152H01L2924/181H01L2224/48091H01L2224/48137H01L2924/00012H01L2924/00014
Inventor 端木鲁玉张俊德宋青林
Owner GOERTEK INC
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